Cypress CY7C6431x Manual De Usuario
CY7C6431x
CY7C64345, CY7C6435x
Document Number: 001-12394 Rev *G
Page 25 of 28
Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
Table 22.Package Handling
Parameter
Description
Minimum
Typical
Maximum
Unit
T
BAKETEMP
Bake Temperature
125
See package label
o
C
T
BAKETIME
Bake Time
See package label
72
hours
001-13191 *C