Manualsbrain.com
  1. Manuales
  2. Marcas
  3. Cypress
  4. CY7C6431x
  5. Manual De Usuario

Cypress CY7C6431x Manual De Usuario

Descargar
Página de 28
CY7C6431x
CY7C64345, CY7C6435x
Document Number: 001-12394 Rev *G
Page 26 of 28
Thermal Impedances 
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability. 
Ordering Information
Table 23. Thermal Impedances per Package
Package
Typical  
θ
JA
 
16 QFN
32.69 
o
C/W
32 QFN
19.51 
o
C/W
48 QFN
17.68
o
C/W
Table 24.Solder Reflow Peak Temperature
Package
Minimum Peak Temperature
Maximum Peak Temperature
16 QFN
240
o
C
260
o
C
32 QFN
240
o
C
260
o
C
48 QFN
240
o
C
260
o
C
Ordering Code
Package 
Information
Flash
SRAM No. of GPIOs
Target Applications
CY7C64315-16LKXC
16-Pin QFN (3x3 mm)
16K
1K
11
Mid-tier FS USB dongle, RC-host 
module
CY7C64315-16LKXCT
16-Pin QFN (Tape and Reel) 
(3x3 mm)
16K
1K
11
Mid-tier FS USB dongle, RC-host 
module
CY7C64316-16LKXC
16-Pin QFN (3x3 mm)
32K
2K
11
Hi-end FS USB dongle, RC-host 
module
CY7C64316-16LKXCT
16-Pin QFN (Tape and Reel) 
(3x3 mm)
32K
2K
11
Hi-end FS USB dongle, RC-host 
module
CY7C64343-32LQXC
32-Pin QFN (3x3 mm)
8K
1K
25
Full speed USB mouse
CY7C64343-32LQXCT
32-Pin QFN (3X3 mm)
8K
1K
25
Full speed USB mouse
CY7C64345-32LQXC
32-Pin QFN
(5x5x0.55 mm)
16K
1K
25
Full speed USB mouse
CY7C64345-32LQXCT
32-Pin QFN (Tape and Reel) 
(5x5x0.55 mm)
16K
1K
25
Full speed USB mouse
CY7C64355-48LTXC
48-Pin QFN
(7x7x0.9 mm)
16K
1K
36
Full speed USB keyboard
CY7C64355-48LTXCT
48-Pin QFN (Tape and Reel) 
(7x7x0.9 mm)
16K
1K
36
Full speed USB keyboard
CY7C64356-48LTXC
48-Pin QFN
(7x7x0.9 mm)
32K
2K
36
Hi-end FS USB keyboard
CY7C64356-48LTXCT
48-Pin QFN (Tape and Reel) 
(7x7x0.9 mm)
32K
2K
36
Hi-end FS USB keyboard
Notes
16. T
J
 = T
A
 + Power x 
θ
JA.
17. To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
18. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. 
Refer to the solder manufacturer specifications.