Cypress CY62147EV30 Manual De Usuario

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 CY62147EV30 MoBL
®
Document #: 38-05440 Rev. *G
Page 3 of 13
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. User guidelines are not tested.
Storage Temperature  ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied  .......................................... –55°C to + 125°C
Supply Voltage to Ground 
Potential ............................. –0.3V to + 3.9V (V
CCmax 
+ 0.3V)
DC Voltage Applied to Outputs
in High-Z State 
............... –0.3V to 3.9V (V
CCmax 
+ 0.3V)
DC Input Voltage 
............ –0.3V to 3.9V (V
CCmax 
+ 0.3V)
Output Current into Outputs (LOW) ............................ 20 mA
Static Discharge Voltage ..........................................  >2001V
(MIL-STD-883, Method 3015)
Latch Up Current ..................................................... >200 mA
Operating Range
Device
Range
Ambient 
Temperature
V
CC 
CY62147EV30LL
Ind’l/Auto-A –40°C to +85°C 
2.2V to 
3.6V
Auto-E
–40°C to +125°C 
Electrical Characteristics 
Over the Operating Range
Parameter
Description
Test Conditions
45 ns (Ind’l/Auto-A)
55 ns (Auto-E)
Unit
Min
Typ 
Max
Min
Typ 
[2]
Max
V
OH
Output HIGH 
Voltage
I
OH
 = –0.1 mA 
2.0
2.0
V
I
OH
 = –1.0 mA, V
CC 
> 2.70V
2.4
2.4
V
V
OL
Output LOW 
Voltage
I
OL
 = 0.1 mA
0.4
0.4
V
I
OL
 = 2.1 mA, V
CC 
= 2.70V 
0.4
0.4
V
V
IH
Input HIGH 
Voltage
V
CC 
= 2.2V to 2.7V
1.8
V
CC 
+ 0.3
1.8
V
CC 
+ 0.3
V
V
CC
= 2.7V to 3.6V
2.2
V
CC 
+ 0.3
2.2
V
CC 
+ 0.3
V
V
IL
Input LOW 
Voltage
V
CC 
= 2.2V to 2.7V
–0.3
0.6
–0.3
0.6
V
V
CC
= 2.7V to 3.6V
–0.3
0.8
–0.3
0.8
V
I
IX
Input Leakage 
Current
GND < V
I
 < V
CC
–1
+1
–4
+4
μA
I
OZ
Output Leakage 
Current
GND < V
< V
CC
, Output Disabled
–1
+1
–4
+4
μA
I
CC
V
CC
 Operating 
Supply Current 
f = f
max
 = 1/t
RC
V
CC
 = V
CC(max)
I
OUT
 = 0 mA
CMOS levels
15
20
15
25
mA
f = 1 MHz
2
2.5
2
3
I
SB1
Automatic CE
Power Down 
Current — 
CMOS Inputs
CE > V
CC
 – 0.2V 
V
IN
 > V
CC 
– 0.2V, V
IN
 < 0.2V
f = f
max
 (Address and Data Only),
 f = 0 (OE, BHE, BLE and WE), 
V
CC
 = 3.60V
1
7
1
20
μA
I
SB2 
Automatic CE 
Power Down 
Current — 
CMOS Inputs
CE > V
CC
 – 0.2V
V
IN
 > V
CC
 – 0.2V or V
IN
 < 0.2V,
f = 0, V
CC
 = 3.60V
1
7
1
20
μA
Capacitance
 
For all packages.
Parameter
Description
Test Conditions
Max
Unit
C
IN
Input Capacitance
T
A
 = 25°C, f = 1 MHz,
V
CC
 = V
CC(typ)
10
pF
C
OUT
Output Capacitance
10
pF
Notes
5. V
IL(min)
 = –2.0V for pulse durations less than 20 ns.
6. V
IH(max) 
= V
CC 
+ 0.75V for pulse durations less than 20 ns.
7. Full device AC operation assumes a minimum of 100 
μs ramp time from 0 to V
CC
(min) and 200 
μs wait time after V
CC 
stabilization.
8. Only chip enable (CE) and byte enables (BHE and BLE) need to be tied to CMOS levels to meet the I
SB2
 / I
CCDR 
spec. Other inputs can be left floating.
9. Tested initially and after any design or process changes that may affect these parameters.