Cypress CY62147EV30 Manual De Usuario
CY62147EV30 MoBL
®
Document #: 38-05440 Rev. *G
Page 3 of 13
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. User guidelines are not tested.
device. User guidelines are not tested.
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied .......................................... –55°C to + 125°C
Power Applied .......................................... –55°C to + 125°C
Supply Voltage to Ground
Potential ............................. –0.3V to + 3.9V (V
Potential ............................. –0.3V to + 3.9V (V
CCmax
+ 0.3V)
DC Voltage Applied to Outputs
in High-Z State
in High-Z State
............... –0.3V to 3.9V (V
CCmax
+ 0.3V)
DC Input Voltage
............ –0.3V to 3.9V (V
CCmax
+ 0.3V)
Output Current into Outputs (LOW) ............................ 20 mA
Static Discharge Voltage .......................................... >2001V
(MIL-STD-883, Method 3015)
(MIL-STD-883, Method 3015)
Latch Up Current ..................................................... >200 mA
Operating Range
Device
Range
Ambient
Temperature
V
CC
CY62147EV30LL
Ind’l/Auto-A –40°C to +85°C
2.2V to
3.6V
Auto-E
–40°C to +125°C
Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions
45 ns (Ind’l/Auto-A)
55 ns (Auto-E)
Unit
Min
Typ
Max
Min
Typ
[2]
Max
V
OH
Output HIGH
Voltage
Voltage
I
OH
= –0.1 mA
2.0
2.0
V
I
OH
= –1.0 mA, V
CC
> 2.70V
2.4
2.4
V
V
OL
Output LOW
Voltage
Voltage
I
OL
= 0.1 mA
0.4
0.4
V
I
OL
= 2.1 mA, V
CC
= 2.70V
0.4
0.4
V
V
IH
Input HIGH
Voltage
Voltage
V
CC
= 2.2V to 2.7V
1.8
V
CC
+ 0.3
1.8
V
CC
+ 0.3
V
V
CC
= 2.7V to 3.6V
2.2
V
CC
+ 0.3
2.2
V
CC
+ 0.3
V
V
IL
Input LOW
Voltage
Voltage
V
CC
= 2.2V to 2.7V
–0.3
0.6
–0.3
0.6
V
V
CC
= 2.7V to 3.6V
–0.3
0.8
–0.3
0.8
V
I
IX
Input Leakage
Current
Current
GND < V
I
< V
CC
–1
+1
–4
+4
μA
I
OZ
Output Leakage
Current
Current
GND < V
O
< V
CC
, Output Disabled
–1
+1
–4
+4
μA
I
CC
V
CC
Operating
Supply Current
f = f
max
= 1/t
RC
V
CC
= V
CC(max)
I
OUT
= 0 mA
CMOS levels
15
20
15
25
mA
f = 1 MHz
2
2.5
2
3
I
SB1
Automatic CE
Power Down
Current —
CMOS Inputs
Power Down
Current —
CMOS Inputs
CE > V
CC
– 0.2V
V
IN
> V
CC
– 0.2V, V
IN
< 0.2V
f = f
max
(Address and Data Only),
f = 0 (OE, BHE, BLE and WE),
V
V
CC
= 3.60V
1
7
1
20
μA
I
SB2
Automatic CE
Power Down
Current —
CMOS Inputs
Power Down
Current —
CMOS Inputs
CE > V
CC
– 0.2V
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V,
f = 0, V
CC
= 3.60V
1
7
1
20
μA
Capacitance
For all packages.
Parameter
Description
Test Conditions
Max
Unit
C
IN
Input Capacitance
T
A
= 25°C, f = 1 MHz,
V
CC
= V
CC(typ)
10
pF
C
OUT
Output Capacitance
10
pF
Notes
5. V
IL(min)
= –2.0V for pulse durations less than 20 ns.
6. V
IH(max)
= V
CC
+ 0.75V for pulse durations less than 20 ns.
7. Full device AC operation assumes a minimum of 100
μs ramp time from 0 to V
CC
(min) and 200
μs wait time after V
CC
stabilization.
8. Only chip enable (CE) and byte enables (BHE and BLE) need to be tied to CMOS levels to meet the I
SB2
/ I
CCDR
spec. Other inputs can be left floating.
9. Tested initially and after any design or process changes that may affect these parameters.