Cypress CY62147EV30 Manual De Usuario
CY62147EV30 MoBL
®
Document #: 38-05440 Rev. *G
Page 4 of 13
Thermal Resistance
[9]
Parameter
Description
Test Conditions
VFBGA
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch, two-layer
printed circuit board
printed circuit board
75
77
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
(Junction to Case)
10
13
°C/W
Figure 4. AC Test Load and Waveforms
Parameters
2.50V
3.0V
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
R
TH
8000
645
Ω
V
TH
1.20
1.75
V
Data Retention Characteristics
Over the Operating Range
Parameter
Description
Conditions
Min
Typ
Max
Unit
V
DR
V
CC
for Data Retention
1.5
V
I
CCDR
[8]
Data Retention Current
V
CC
= 1.5V, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Ind’l/Auto-A
0.8
7
μA
Auto-E
12
t
CDR
[9]
Chip Deselect to Data Retention Time
0
ns
t
R
[10]
Operation Recovery Time
t
RC
ns
Figure 5. Data Retention Waveform
[
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
ALL INPUT PULSES
R
TH
R1
Equivalent to: THEVENIN EQUIVALENT
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5V
DATA RETENTION MODE
t
R
V
CC
CE or
BHE.BLE
Notes
10. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100
μs or stable at V
CC(min)
> 100
μs.
11. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.