Manualsbrain.com
es
English
Deutsch
Français
Italiano
Português
Русский
조선말, 한국어
日本語
中文
Manuales
Marcas
Intel
E8200
Manual De Usuario
Intel E8200 BX80570E8200A Manual De Usuario
Los códigos de productos
BX80570E8200A
Descargar
Me gusta
Pantalla completa
Estándar
Página
de
128
ir
Thermal and Mechanical Design Guidelines
5
7.2
Board and System Implementation of Intel
®
QST......................................68
7.3
Intel
®
QST Configuration & Tuning..........................................................70
7.4
Fan Hub Thermistor and Intel
®
QST ........................................................70
Appendix A
LGA775 Socket Heatsink Loading ......................................................................71
A.1
LGA775 Socket Heatsink Considerations ..................................................71
A.2
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design .................................................................71
A.3
Heatsink Preload Requirement Limitations................................................71
A.3.1
Motherboard Deflection Metric Definition.....................................72
A.3.2
Board Deflection Limits ............................................................73
A.3.3
Board Deflection Metric Implementation Example.........................74
A.3.4
Additional Considerations .........................................................75
A.3.4.1
Motherboard Stiffening Considerations .........................76
A.4
Heatsink Selection Guidelines.................................................................76
Appendix B
Heatsink Clip Load Metrology ............................................................................77
B.1
Overview ............................................................................................77
B.2
Test Preparation...................................................................................77
B.2.1
Heatsink Preparation................................................................77
B.2.2
Typical Test Equipment ............................................................80
B.3
Test Procedure Examples.......................................................................80
B.3.1
Time-Zero, Room Temperature Preload Measurement...................81
B.3.2
Preload Degradation under Bake Conditions ................................81
Appendix C
Thermal Interface Management.........................................................................83
C.1
Bond Line Management .........................................................................83
C.2
Interface Material Area..........................................................................83
C.3
Interface Material Performance...............................................................83
Appendix D
Case Temperature Reference Metrology..............................................................85
D.1
Objective and Scope .............................................................................85
D.2
Supporting Test Equipment....................................................................85
D.3
Thermal calibration and controls.............................................................87
D.4
IHS Groove .........................................................................................87
D.5
Thermocouple Attach Procedure .............................................................91
D.5.1
Thermocouple Conditioning and Preparation ................................91
D.5.2
Thermocouple Attachment to the IHS .........................................92
D.5.3
Solder Process ........................................................................97
D.5.4
Cleaning & Completion of Thermocouple Installation................... 100
D.6
Thermocouple Wire Management .......................................................... 104
Appendix E
Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Appendix F
Fan Performance for Reference Design ............................................................. 109
Appendix G
Mechanical Drawings ..................................................................................... 111
Appendix H
Intel
®
Enabled Reference Solution Information .................................................. 127
Anterior
Siguiente
1
…
3
4
5
6
7
…
128