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Intel
E8190
Manual De Usuario
Intel E8190 EU80570PJ0676MN Manual De Usuario
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EU80570PJ0676MN
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4
Thermal and Mechanical Design Guidelines
4.2.6
System Considerations .............................................................. 37
4.2.7
Operating System and Application Software Considerations ........... 38
4.2.8
THERMTRIP# Signal .................................................................. 38
4.2.9
Cooling System Failure Warning ................................................. 38
4.2.10
Digital Thermal Sensor .............................................................. 39
4.2.11
Platform Environmental Control Interface (PECI) .......................... 40
5
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 41
5.1
Overview of the BTX Reference Design ..................................................... 41
5.1.1
Target Heatsink Performance ..................................................... 41
5.1.2
Acoustics ................................................................................. 42
5.1.3
Effective Fan Curve ................................................................... 43
5.1.4
Voltage Regulator Thermal Management ...................................... 44
5.1.5
Altitude ................................................................................... 45
5.1.6
Reference Heatsink Thermal Validation ........................................ 45
5.2
Environmental Reliability Testing ............................................................. 45
5.2.1
Structural Reliability Testing ...................................................... 45
5.2.1.1
Random Vibration Test Procedure ................................ 45
5.2.1.2
Shock Test Procedure ................................................. 46
5.2.2
Power Cycling .......................................................................... 47
5.2.3
Recommended BIOS/CPU/Memory Test Procedures ...................... 48
5.3
Material and Recycling Requirements........................................................ 48
5.4
Safety Requirements .............................................................................. 49
5.5
Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........ 49
5.6
Preload and TMA Stiffness ....................................................................... 50
5.6.1
Structural Design Strategy ......................................................... 50
5.6.2
TMA Preload verse Stiffness ....................................................... 50
6
ATX Thermal/Mechanical Design Information ........................................................ 53
6.1
ATX Reference Design Requirements ........................................................ 53
6.2
Validation Results for Reference Design .................................................... 55
6.2.1
Heatsink Performance ............................................................... 55
6.2.2
Acoustics ................................................................................. 56
6.2.3
Altitude ................................................................................... 56
6.2.4
Heatsink Thermal Validation ....................................................... 57
6.3
Environmental Reliability Testing ............................................................. 57
6.3.1
Structural Reliability Testing ...................................................... 57
6.3.1.1
Random Vibration Test Procedure ................................ 57
6.3.1.2
Shock Test Procedure ................................................. 58
6.3.2
Power Cycling .......................................................................... 59
6.3.3
Recommended BIOS/CPU/Memory Test Procedures ...................... 60
6.4
Material and Recycling Requirements........................................................ 60
6.5
Safety Requirements .............................................................................. 61
6.6
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 61
6.7
Reference Attach Mechanism ................................................................... 62
6.7.1
Structural Design Strategy ......................................................... 62
6.7.2
Mechanical Interface to the Reference Attach Mechanism .............. 63
7
Intel
®
Quiet System Technology (Intel
®
QST) ...................................................... 65
7.1
Intel
®
QST Algorithm .............................................................................. 65
7.1.1
Output Weighting Matrix ............................................................ 66
7.1.2
Proportional-Integral-Derivative (PID) ......................................... 66
7.2
Board and System Implementation of Intel
®
QST ....................................... 68
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