Shanghai MXCHIP Information Technology Co. Ltd. EMW3239 Manual De Usuario

Application Note

[Page 3]

Design Considerations of EMW3239

Figure 2.3 SMT Package ..................................................................................................................................... 7

Figure 2.4 PCB Design ........................................................................................................................................ 9

Figure 2.5 Minimum PCB Clearance Area ........................................................................................................ 10

Figure 2.6 Position of the Module ..................................................................................................................... 10

Figure 2.7 Size of External Antenna .................................................................................................................. 11

Figure 3.1Switch Set Up .................................................................................................................................... 13

Figure 3.2Power Light ....................................................................................................................................... 13

Figure 3.3 Name in Device Manager ................................................................................................................. 13

Figure 3.4 Install J-Flash ................................................................................................................................... 14

Figure 3.5 J-Flash signature ............................................................................................................................... 14

Figure 3.6 Target Interface Set Up ..................................................................................................................... 14

Figure 3.7 MCU Set Up ..................................................................................................................................... 15

Figure 3.8 Production Set Up ............................................................................................................................ 15

Figure 3.9 Position of Routers ........................................................................................................................... 16

Figure 4.1 Stencils size ...................................................................................................................................... 17

Figure 4.2 Temperature Curve of Secondary Reflow ........................................................................................ 17

Table Content

Table 2.1 Switch Mode ........................................................................................................................................ 7

Table 3.1Device List .......................................................................................................................................... 12

Table 3.2Download Websites ............................................................................................................................. 12