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Shanghai MXCHIP Information Technology Co. Ltd.
EMW3239
Benutzerhandbuch
Shanghai MXCHIP Information Technology Co. Ltd. EMW3239 Benutzerhandbuch
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Application Note
[Page 3]
Design Considerations of EMW3239
Figure 2.3 SMT Package ..................................................................................................................................... 7
Figure 2.4 PCB Design ........................................................................................................................................ 9
Figure 2.5 Minimum PCB Clearance Area ........................................................................................................ 10
Figure 2.6 Position of the Module ..................................................................................................................... 10
Figure 2.7 Size of External Antenna .................................................................................................................. 11
Figure 3.1Switch Set Up .................................................................................................................................... 13
Figure 3.2Power Light ....................................................................................................................................... 13
Figure 3.3 Name in Device Manager ................................................................................................................. 13
Figure 3.4 Install J-Flash ................................................................................................................................... 14
Figure 3.5 J-Flash signature ............................................................................................................................... 14
Figure 3.6 Target Interface Set Up ..................................................................................................................... 14
Figure 3.7 MCU Set Up ..................................................................................................................................... 15
Figure 3.8 Production Set Up ............................................................................................................................ 15
Figure 3.9 Position of Routers ........................................................................................................................... 16
Figure 4.1 Stencils size ...................................................................................................................................... 17
Figure 4.2 Temperature Curve of Secondary Reflow ........................................................................................ 17
Table Content
Table 2.1 Switch Mode ........................................................................................................................................ 7
Table 3.1Device List .......................................................................................................................................... 12
Table 3.2Download Websites ............................................................................................................................. 12
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