Shenzhen Honeycomb Technologies Company Limited HBT24B13AN Manual De Usuario
HBT24B13AN
©2013
Honeycomb Technologies Advance Information Page 10
SCHEMATIC
A schematic diagram of the module is shown in Figure 6 and the Bill of Materials
(BOM) is shown in Table 2. The HBT24B13AN module is based on the BK3211 chip is a
highly integrated single-chip Bluetooth device. ceiver IC. The serial I/O (SCK, SDI, SDO
and CS), RESET, STATE, SELECT and INT pins are brought out to the module pins. The
SDO signal is tri-state buffered by IC2 to solve a silicon errata where the SDO signal
does not release to a high-impedance state after the CS pin returns to its inactive
state. Crystal Y1 is a 26 MHz crystal with a frequency tolerance of ±20 ppm @ 25°C to
±40 ppm.
(BOM) is shown in Table 2. The HBT24B13AN module is based on the BK3211 chip is a
highly integrated single-chip Bluetooth device. ceiver IC. The serial I/O (SCK, SDI, SDO
and CS), RESET, STATE, SELECT and INT pins are brought out to the module pins. The
SDO signal is tri-state buffered by IC2 to solve a silicon errata where the SDO signal
does not release to a high-impedance state after the CS pin returns to its inactive
state. Crystal Y1 is a 26 MHz crystal with a frequency tolerance of ±20 ppm @ 25°C to
±40 ppm.
FIGURE 6 HBT24B13AN SCHEMATIC
TABLE 2
HBT24B13AN BILL OF MATERIALS