Shenzhen Honeycomb Technologies Company Limited HBT24B13AN Manual De Usuario
HBT24B13AN
©2013
Honeycomb Technologies Advance Information Page 11
Printed Circuit Board
The HBT24B13AN module printed circuit board is con-structed with FR4 material,
two layers and 0.8mm thick. The layers are shown in Figure 7 through Figure 8. The
stack up of the PCB is shown in Figure9
two layers and 0.8mm thick. The layers are shown in Figure 7 through Figure 8. The
stack up of the PCB is shown in Figure9
FIGURE 7 TOP COPPER
FIGURE 8 BOTTOM COPPER