Intel 4 530 NE80546PG0801M Hoja De Datos
Los códigos de productos
NE80546PG0801M
Datasheet
77
Boxed Processor Specifications
7.1.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. See
and the
Intel
®
Pentium
®
4 Processor on 90 nm Process Thermal Design Guidelines for details on the
processor weight and heatsink requirements.
Note:
The processor retention mechanism, based on the Intel reference design, should be used to ensure
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention
mechanism.
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention
mechanism.
The target load applied by the clips to the processor heat spreader for Intel's reference design is
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices (such as plates) are not necessary and should not be used
along with the reference mechanical components and boxed processor. Using such devices
increases the compressive load on the processor package and socket, likely beyond the maximum
load that is specified for those components. See the Intel
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices (such as plates) are not necessary and should not be used
along with the reference mechanical components and boxed processor. Using such devices
increases the compressive load on the processor package and socket, likely beyond the maximum
load that is specified for those components. See the Intel
®
Pentium
®
4 Processor on 90 nm Process
Thermal Design Guidelines for details on the Intel reference design.
Chassis that have adequate clearance between the motherboard and chassis wall (minimum
0.250 inch) should be selected to ensure the board's underside bend does not contact the chassis.
0.250 inch) should be selected to ensure the board's underside bend does not contact the chassis.
Figure 17. Space Requirements for the Boxed Processor (Top View)