Техническая Спецификация для Intel 4 530 NE80546PG0801M

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The boxed processor fan heatsink will not weigh more than 450 grams. See 

 and the 

 4 Processor on 90 nm Process Thermal Design Guidelines for details on the 

processor weight and heatsink requirements.

The processor retention mechanism, based on the Intel reference design, should be used to ensure 
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The 
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention 
mechanism.

The target load applied by the clips to the processor heat spreader for Intel's reference design is 
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a 
bow or bend in the board due to this compressive load on the processor package and the socket. 
The level of bow or bend depends on the motherboard material properties and component layout. 
Any additional board stiffening devices (such as plates) are not necessary and should not be used 
along with the reference mechanical components and boxed processor. Using such devices 
increases the compressive load on the processor package and socket, likely beyond the maximum 
load that is specified for those components. See the Intel

Thermal Design Guidelines for details on the Intel reference design.

Chassis that have adequate clearance between the motherboard and chassis wall (minimum 
0.250 inch) should be selected to ensure the board's underside bend does not contact the chassis.