STMicroelectronics M95M02-DRMN6TP Memory IC M95M02-DRMN6TP Hoja De Datos
Los códigos de productos
M95M02-DRMN6TP
Package mechanical data
M95M02-DR
DocID18203 Rev 8
Figure 24. M95M02-DRCS6TP/K, WLCSP standard package outline, bump side view
1. Preliminary data.
2. Drawing is not to scale.
2. Drawing is not to scale.
Table 15. M95M02-DRCS6TP/K, WLCSP package mechanical data
(1)
1. Preliminary data.
Symbol
millimeters
inches
(2)
2. Values in inches are converted from mm and rounded to four decimal digits.
Min
Typ
Max
Min
Typ
Max
A
0.540
0.500
0.580
0.0213
0.0197
0.0228
A1
0.190
-
-
0.0075
-
-
A2
0.350
-
-
0.0138
-
-
B (bump
diameter)
0.270
-
-
0.0106
-
-
D
3.536
3.556
3.576
0.1392
0.1400
0.1408
E
1.991
2.011
2.031
0.0784
0.0792
0.0800
e
-
0.500
-
-
0.0197
-
e1
-
2.100
-
-
0.0827
-
e2
-
1.000
-
-
0.0394
-
e3
-
1.400
-
-
0.0551
-
Side view
Bump side
A
A2
D
e1
e2
e3
E
e
MS30974V1
A1