Freescale Semiconductor Demonstration Board for Freescale MC9S12XHY256 Microcontroller DEMO9S12XHY256 DEMO9S12XHY256 Manual De Usuario

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DEMO9S12XHY256

Electrical Characteristics

MC9S12XHY-Family Reference Manual, Rev. 1.04

724

Freescale Semiconductor

A.1.9

I/O Characteristics

This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST and supply pins.

Table A-5. Thermal Package Characteristics (MC9S12XHY)

The values for thermal resistance are achieved by package simulations

Num

Rating

Symbol

Min

Typ

Max

Unit

LQFP 112

Junction to Ambient

, Natural Convection

Single layer board(1s)

Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets
JEDEC specification for this package.

—

C/W

Junction to Ambient, Natural Convection
Four layer board (2s2p)

—

C/W

Junction to Ambient,(@200 ft/min)
Single layer board(1s)

JMA

—

C/W

Junction to Ambient, (@200 ft/min)
Four layer board (2s2p)

JMA

—

C/W

Junction to Board

Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for
the specified package.

—

C/W

Junction to Case

Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer

JCtop

—

C/W

Junction to Package Top

Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT

—

C/W

LQFP 100

Junction to Ambient, Natural Convection
Single layer board(1s)

—

C/W