Freescale Semiconductor Demonstration Board for Freescale MC9S12XHY256 Microcontroller DEMO9S12XHY256 DEMO9S12XHY256 Manuale Utente
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DEMO9S12XHY256
Electrical Characteristics
MC9S12XHY-Family Reference Manual, Rev. 1.04
724
Freescale Semiconductor
A.1.9
I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST and supply pins.
Table A-5. Thermal Package Characteristics (MC9S12XHY)
1
1
The values for thermal resistance are achieved by package simulations
Num
C
Rating
Symbol
Min
Typ
Max
Unit
LQFP 112
1
D
Junction to Ambient
2
, Natural Convection
Single layer board(1s)
2
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets
JEDEC specification for this package.
JEDEC specification for this package.
θ
JA
—
—
59
°
C/W
2
D
Junction to Ambient, Natural Convection
Four layer board (2s2p)
Four layer board (2s2p)
θ
JA
—
—
49
°
C/W
3
D
Junction to Ambient,(@200 ft/min)
Single layer board(1s)
Single layer board(1s)
θ
JMA
—
—
50
°
C/W
4
D
Junction to Ambient, (@200 ft/min)
Four layer board (2s2p)
Four layer board (2s2p)
θ
JMA
—
—
43
°
C/W
5
D
Junction to Board
3
3
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for
the specified package.
the specified package.
θ
JB
—
—
37
°
C/W
6
D
Junction to Case
4
4
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
for the case temperature. Reported value includes the thermal resistance of the interface layer
θ
JCtop
—
—
14
°
C/W
7
D
Junction to Package Top
5
5
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT
Ψ
JT
—
—
2
°
C/W
LQFP 100
8
D
Junction to Ambient, Natural Convection
Single layer board(1s)
Single layer board(1s)
θ
JA
—
—
60
°
C/W
9
D
Junction to Ambient, Natural Convection
Four layer board (2s2p)
Four layer board (2s2p)
θ
JA
—
—
47
°
C/W
10
D
Junction to Ambient,(@200 ft/min)
Single layer board(1s)
Single layer board(1s)
θ
JMA
—
—
50
°
C/W
11
D
Junction to Ambient, (@200 ft/min)
Four layer board (2s2p)
Four layer board (2s2p)
θ
JMA
—
—
41
°
C/W
12
D
Junction to Board
θ
JB
—
—
33
°
C/W
13
D
Junction to Case
θ
JCtop
—
—
14
°
C/W
14
D
Junction to Package Top
Ψ
JT
—
—
2
°
C/W