STMicroelectronics Demonstration board using a dual full-bridge L6227Q EVAL6227QR EVAL6227QR Hoja De Datos
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EVAL6227QR
Thermal management
L6227Q
22/27
7 Thermal
management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition. Therefore, it has to
be taken into account very carefully. Besides the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness. For instance, using a VFQFPN32L
5x5 package the typical Rth(JA) is about 42 °C/W when mounted on a double-layer FR4
PCB with a dissipating copper surface of 0.5 cm
current that can be delivered by the device in a safe operating condition. Therefore, it has to
be taken into account very carefully. Besides the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness. For instance, using a VFQFPN32L
5x5 package the typical Rth(JA) is about 42 °C/W when mounted on a double-layer FR4
PCB with a dissipating copper surface of 0.5 cm
2
on the top side plus 6 cm
2
ground layer
connected through 18 via holes (9 below the IC).