STMicroelectronics Demonstration board using a dual full-bridge L6227Q EVAL6227QR EVAL6227QR Hoja De Datos
Los códigos de productos
EVAL6227QR
L6227Q
Package mechanical data
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Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Note:
1
VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no
lead. Very thin profile: 0.80 < A = 1.00 mm.
lead. Very thin profile: 0.80 < A = 1.00 mm.
2
Details of terminal 1 are optional but must be located on the top surface of the package by
using either a mold or marked features.
using either a mold or marked features.
Table 9.
VFQFPN32 5x5x1.0 pitch 0.50
Dim.
Databook (mm)
Min
Typ
Max
A
0.80
0.85
0.95
b
0.18
0.25
0.30
b1
0.165
0.175
0.185
D
4.85
5.00
5.15
D2
3.00
3.10
3.20
D3
1.10
1.20
1.30
E
4.85
5.00
5.15
E2
4.20
4.30
4.40
E3
0.60
0.70
0.80
e
0.50
L
0.30
0.40
0.50
ddd
0.08