Intel Core™2 Quad Processor Q9400 (6M Cache, 2.66 GHz, 1333 MHz FSB) BX80569Q9400 Manual De Usuario
Los códigos de productos
BX80569Q9400
Introduction
12
Datasheet
The processor uses some of the infrastructure already enabled by 775_VR_CONFIG_05
platforms including heatsink, heatsink retention mechanism, and socket.
Manufacturability is a high priority; hence, mechanical assembly may be completed
from the top of the baseboard and should not require any special tooling.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front Side Bus” refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.
1.1.1
Processor Terminology Definitions
Commonly used terms are explained here for clarification:
• Intel
®
Core™2 Extreme processor QX9000 series — Quad core Extreme
Edition processor in the FC-LGA6 package with two 6 MB L2 cache.
• Intel
®
Core™2 Quad processor Q9000 series — Quad core processor in the FC-
LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches.
• Intel
®
Core™2 Quad processor Q8000 Series — Quad core processor in the
FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches..
• Intel
®
Core™2 Quad processor Q9000S series — Low power Quad core
processor in the FC-LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches.
• Intel
®
Core™2 Quad Processor Q8000S Series — Low power Quad core
processor in the FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches
caches.
• Processor — For this document, the term processor is the generic form of the
Intel
®
Core™2 Extreme processor QX9000 series, the Intel
®
Core™2 Quad
processor Q9000, Q9000S, Q8000, and Q8000S series.
• Enhanced Intel
®
Core
TM
microarchitecture — A new foundation for Intel
®
architecture-based desktop, mobile and mainstream server multi-core processors.
For additional information refer to:
http://www.intel.com/technology/architecture/
coremicro/
• Keep-out zone — The area on or near the processor that system design can not
utilize.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processor mates with the system board through a surface
• LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All