Manual De UsuarioTabla de contenidos1.1 Overview21.1.1 PowerPC 603 Microprocessor Features21.2 General Parameters41.3 Electrical and Thermal Characteristics41.3.1 DC Electrical Characteristics41.3.2 AC Electrical Characteristics61.3.2.1 Clock AC Specifications61.3.2.2 Input AC Specifications71.3.2.3 Output AC Specifications91.3.3 JTAG AC Timing Specifications121.4 Pinout Diagram141.5 Pinout Listing151.6 Package Description171.6.1 Motorola Wire-Bond CQFP Package Description171.6.1.1 Package Parameters171.6.1.2 Mechanical Dimensions of the Motorola Wire...181.6.2 IBM C4-CQFP Package Description191.6.2.1 Package Parameters191.6.2.2 Mechanical Dimensions of the IBM C4-CQFP P...201.7 System Design Information211.7.1 PLL Configuration211.7.2 PLL Power Supply Filtering221.7.3 Decoupling Recommendations221.7.4 Connection Recommendations221.7.5 Thermal Management Information for the Motor...221.7.5.1 Thermal Characteristics for the Motorola W...221.7.5.2 Thermal Management Example221.7.6 Thermal Management Information for the IBM P...241.7.6.1 Thermal Characteristics for the IBM C4-CQF...241.7.6.2 Thermal Management Example241.8 Ordering Information261.8.1 Motorola Part Number Key261.8.2 IBM Part Number Key26A.1 Package Environmental, Operation, Shipment, A....27A.2 Card Assembly Recommendations28A.2.1 Card Assembly Process28Tamaño: 300 KBPáginas: 30Language: EnglishManuales abiertas