Hoja De Datos (HH80551PG0802MN)Tabla de contenidos1 Introduction111.1 Terminology121.1.1 Processor Packaging Terminology121.2 References132 Electrical Specifications152.1 Power and Ground Lands152.2 Decoupling Guidelines152.2.1 VCC Decoupling152.2.2 VTT Decoupling152.2.3 FSB Decoupling162.3 Voltage Identification162.4 Reserved, Unused, FC and TESTHI Signals182.5 Voltage and Current Specifications192.5.1 Absolute Maximum and Minimum Ratings192.5.2 DC Voltage and Current Specifications192.5.3 VCC Overshoot Specification252.5.4 Die Voltage Validation262.6 Signaling Specifications262.6.1 FSB Signal Groups262.6.2 GTL+ Asynchronous Signals282.6.3 FSB DC Specifications292.6.3.1 GTL+ Front Side Bus Specifications312.7 Clock Specifications322.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking322.7.2 FSB Frequency Select Signals322.7.3 Phase Lock Loop (PLL) and Filter333 Package Mechanical Specifications353.1 Package Mechanical Drawing353.2 Processor Component Keep-Out Zones393.3 Package Loading Specifications393.4 Package Handling Guidelines393.5 Package Insertion Specifications403.6 Processor Mass Specification403.7 Processor Materials403.8 Processor Markings403.9 Processor Land Coordinates424 Land Listing and Signal Descriptions434.1 Processor Land Assignments434.2 Alphabetical Signals Reference665 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology795.2 Processor Thermal Features795.2.1 Thermal Monitor795.2.2 On-Demand Mode805.2.3 PROCHOT# Signal805.2.4 FORCEPR# Signal Pin815.2.5 THERMTRIP# Signal825.2.6 TCONTROL and Fan Speed Reduction825.2.7 Thermal Diode826 Features856.1 Power-On Configuration Options856.2 Clock Control and Low Power States856.2.1 Normal State866.2.2 HALT and Enhanced HALT Powerdown States866.2.2.1 HALT Powerdown State866.2.2.2 Enhanced HALT Powerdown State876.2.3 Stop-Grant State876.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State886.2.4.1 HALT Snoop State, Grant Snoop State886.2.4.2 Enhanced HALT Snoop State886.2.5 Enhanced Intel SpeedStep® Technology887 Boxed Processor Specifications897.1 Mechanical Specifications907.1.1 Boxed Processor Cooling Solution Dimensions907.1.2 Boxed Processor Fan Heatsink Weight917.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly917.2 Electrical Requirements917.2.1 Fan Heatsink Power Supply917.3 Thermal Specifications937.3.1 Boxed Processor Cooling Requirements937.3.2 Variable Speed Fan958 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications978.1 Mechanical Specifications988.1.1 Cooling Solution Dimensions988.1.2 Boxed Processor Fan Heatsink Weight988.1.3 Boxed Processor Support and Retention Module (SRM)998.2 Electrical Requirements998.2.1 Fan Heatsink Power Supply998.3 Thermal Specifications1018.3.1 Boxed Processor Cooling Requirements1018.3.2 Variable Speed Fan1029 Debug Tools Specifications1059.1 Logic Analyzer Interface (LAI)1059.1.1 Mechanical Considerations1059.1.2 Electrical Considerations105Tamaño: 3 MBPáginas: 106Language: EnglishManuales abiertas