Manuels d'utilisation pour Intel Pentium D 830

Table des matières

• 1 Introduction

  11
  • 1.1 Terminology

    12
    • 1.1.1 Processor Packaging Terminology

      12
  • 1.2 References

    13
• 2 Electrical Specifications

  15
  • 2.1 Power and Ground Lands

    15
  • 2.2 Decoupling Guidelines

    15
    • 2.2.1 VCC Decoupling

      15
    • 2.2.2 VTT Decoupling

      15
    • 2.2.3 FSB Decoupling

      16
  • 2.3 Voltage Identification

    16
  • 2.4 Reserved, Unused, FC and TESTHI Signals

    18
  • 2.5 Voltage and Current Specifications

    19
    • 2.5.1 Absolute Maximum and Minimum Ratings

      19
    • 2.5.2 DC Voltage and Current Specifications

      19
    • 2.5.3 VCC Overshoot Specification

      25
    • 2.5.4 Die Voltage Validation

      26
  • 2.6 Signaling Specifications

    26
    • 2.6.1 FSB Signal Groups

      26
    • 2.6.2 GTL+ Asynchronous Signals

      28
    • 2.6.3 FSB DC Specifications

      29
      • 2.6.3.1 GTL+ Front Side Bus Specifications

        31
  • 2.7 Clock Specifications

    32
    • 2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking

      32
    • 2.7.2 FSB Frequency Select Signals

      32
    • 2.7.3 Phase Lock Loop (PLL) and Filter

      33
• 3 Package Mechanical Specifications

  35
  • 3.1 Package Mechanical Drawing

    35
  • 3.2 Processor Component Keep-Out Zones

    39
  • 3.3 Package Loading Specifications

    39
  • 3.4 Package Handling Guidelines

    39
  • 3.5 Package Insertion Specifications

    40
  • 3.6 Processor Mass Specification

    40
  • 3.7 Processor Materials

    40
  • 3.8 Processor Markings

    40
  • 3.9 Processor Land Coordinates

    42
• 4 Land Listing and Signal Descriptions

  43
  • 4.1 Processor Land Assignments

    43
  • 4.2 Alphabetical Signals Reference

    66
• 5 Thermal Specifications and Design Considerations

  75
  • 5.1 Processor Thermal Specifications

    75
    • 5.1.1 Thermal Specifications

      75
    • 5.1.2 Thermal Metrology

      79
  • 5.2 Processor Thermal Features

    79
    • 5.2.1 Thermal Monitor

      79
    • 5.2.2 On-Demand Mode

      80
    • 5.2.3 PROCHOT# Signal

      80
    • 5.2.4 FORCEPR# Signal Pin

      81
    • 5.2.5 THERMTRIP# Signal

      82
    • 5.2.6 TCONTROL and Fan Speed Reduction

      82
    • 5.2.7 Thermal Diode

      82
• 6 Features

  85
  • 6.1 Power-On Configuration Options

    85
  • 6.2 Clock Control and Low Power States

    85
    • 6.2.1 Normal State

      86
    • 6.2.2 HALT and Enhanced HALT Powerdown States

      86
      • 6.2.2.1 HALT Powerdown State

        86
      • 6.2.2.2 Enhanced HALT Powerdown State

        87
    • 6.2.3 Stop-Grant State

      87
    • 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State

      88
      • 6.2.4.1 HALT Snoop State, Grant Snoop State

        88
      • 6.2.4.2 Enhanced HALT Snoop State

        88
    • 6.2.5 Enhanced Intel SpeedStep® Technology

      88
• 7 Boxed Processor Specifications

  89
  • 7.1 Mechanical Specifications

    90
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      90
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      91
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      91
  • 7.2 Electrical Requirements

    91
    • 7.2.1 Fan Heatsink Power Supply

      91
  • 7.3 Thermal Specifications

    93
    • 7.3.1 Boxed Processor Cooling Requirements

      93
    • 7.3.2 Variable Speed Fan

      95
• 8 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications

  97
  • 8.1 Mechanical Specifications

    98
    • 8.1.1 Cooling Solution Dimensions

      98
    • 8.1.2 Boxed Processor Fan Heatsink Weight

      98
    • 8.1.3 Boxed Processor Support and Retention Module (SRM)

      99
  • 8.2 Electrical Requirements

    99
    • 8.2.1 Fan Heatsink Power Supply

      99
  • 8.3 Thermal Specifications

    101
    • 8.3.1 Boxed Processor Cooling Requirements

      101
    • 8.3.2 Variable Speed Fan

      102
• 9 Debug Tools Specifications

  105
  • 9.1 Logic Analyzer Interface (LAI)

    105
    • 9.1.1 Mechanical Considerations

      105
    • 9.1.2 Electrical Considerations

      105