Intel SL2YM Manuel D’Utilisation

69

1. See Figure 45, label N.

The boxed processor fan heatsink will not weigh more than 225 grams. See 

Section 4.0

 and 

Section 

5.0

 for details on the heatsink preformance requirements and processor weight.

The boxed processor requires processor retention mechanism(s) to secure the processor in the 242-
contact slot connector.  S.E.C.C. processors must use either the retention mechanism described in 
AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order Number 
243333), or retention mechanisms that have been designed to support S.E.C.C., S.E.C.C.2, and 
Single Edge Processor Package (S.E.P.P.) form factors (also known as universal retention 
mechanisms).  S.E.C.C.2 processors must use either retention mechanisms described in AP-826, 
Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages (Order 
Number 243748). The boxed processor will not ship with a retention mechanism. Motherboards 
designed for use by system integrators must include retention mechanisms that support the 
S.E.C.C. and S.E.C.C.2 form factors and the appropriate installation instructions.

Some boxed Pentium II processors using the S.E.C.C. packaging technology were shipped with fan 
heatsink supports.  These supports differ from supports for passive heatsinks. The boxed processor 
fan heatsink support requires heatsink support holes in the motherboard. Location and size of these 
holes are given in 

Figure 44

.

A

Figure 39

S.E.C.C. Fan Heatsink Depth (off processor extended 
thermal plate)

-

1.1

1.3

B

Figure 39

S.E.C.C. Fan Heatsink Height Above Motherboard

Note 1

0.5

-

C

Figure 40

S.E.C.C. Fan Heatsink Height

-

2.1

2.2

D

Figure 40

S.E.C.C. Fan Heatsink Width (plastic shroud only)

-

4.8

4.9

E

Figure 40

S.E.C.C. Power Cable Connector Location From Edge 
of Fan Heatsink Shroud

1.3

-

1.45

F

Figure 41

S.E.C.C.2 Fan Heatsink Depth (off processor substrate)

-

1.3

1.4

G

Figure 41

S.E.C.C.2 Fan Heatsink Height Above Motherboard

0.4

0.6

-

H

Figure 42

S.E.C.C.2 Fan Heatsink Height

-

2.0

2.2

I

Figure 42

S.E.C.C.2 Fan Heatsink Width (plastic shroud only)

-

4.7

4.8

J

Figure 42

S.E.C.C.2 Power Cable Connector Location From Edge 
of Fan Heatsink Shroud

1.4

-

1.45

K

Figure 43

Airflow keep out zones from end of fan heatsink

0.40

-

-

L

Figure 43

Airflow keepout zones from face of fan heatsink

0.20

-

-