Manuels d'utilisation pour Intel SL2YM

Table des matières

• 1.0 Introduction

  7
  • 1.1 Terminology

    8
    • 1.1.1 S.E.C. Cartridge Terminology

      8
  • 1.2 References

    9
• 2.0 Electrical Specifications

  10
  • 2.1 Processor System Bus and VREF

    10
  • 2.2 Clock Control and Low Power States

    11
    • 2.2.1 Normal State—State 1

      12
    • 2.2.2 AutoHALT Powerdown State—State 2

      12
    • 2.2.3 Stop-Grant State—State 3

      12
    • 2.2.4 HALT/Grant Snoop State—State 4

      13
    • 2.2.5 Sleep State—State 5

      13
    • 2.2.6 Deep Sleep State—State 6

      13
    • 2.2.7 Clock Control

      14
  • 2.3 Power and Ground Pins

    14
  • 2.4 Decoupling Guidelines

    14
    • 2.4.1 Processor VCC CORE Decoupling

      15
    • 2.4.2 Processor System Bus AGTL+ Decoupling

      15
  • 2.5 Processor System Bus Clock and Processor Clocking

    15
    • 2.5.1 Mixing Processors of Different Frequencies

      15
  • 2.6 Voltage Identification

    15
  • 2.7 Processor System Bus Unused Pins

    17
  • 2.8 Processor System Bus Signal Groups

    17
    • 2.8.1 Asynchronous vs. Synchronous for System Bus Signals

      19
    • 2.8.2 System Bus Frequency Select Signal (100/66#)

      19
  • 2.9 Test Access Port (TAP) Connection

    20
  • 2.10 Maximum Ratings

    20
  • 2.11 Processor DC Specifications

    21
  • 2.12 AGTL+ System Bus Specifications

    24
  • 2.13 System Bus AC Specifications

    25
• 3.0 System Bus Signal Simulations

  36
  • 3.1 System Bus Clock (BCLK) Signal Quality Specifications and Measurement Guidelines

    37
  • 3.2 AGTL+ Signal Quality Specifications and Measurement Guidelines

    38
  • 3.3 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines

    40
    • 3.3.1 Overshoot/Undershoot Guidelines

      41
    • 3.3.2 Ringback Specification

      41
    • 3.3.3 Settling Limit Guideline

      42
• 4.0 Thermal Specifications and Design Considerations

  42
  • 4.1 Thermal Specifications

    43
    • 4.1.1 Thermal Diode

      44
• 5.0 S.E.C.C. and S.E.C.C.2 Mechanical Specifications

  44
  • 5.1 S.E.C.C. Mechnical Specifications

    45
  • 5.2 S.E.C.C.2 Mechanical Specification

    52
  • 5.3 Processor Package Materials Information

    57
  • 5.4 Pentium ® II Processor Signal Listing

    58
• 6.0 Boxed Processor Specifications

  64
  • 6.1 Introduction

    64
  • 6.2 Mechanical Specifications

    66
    • 6.2.1 Boxed Processor Fan Heatsink Dimensions

      66
    • 6.2.2 Boxed Processor Fan Heatsink Weight

      69
    • 6.2.3 Boxed Processor Retention Mechanism and Fan Heatsink Supports

      69
  • 6.3 Boxed Processor Requirements

    72
    • 6.3.1 Fan Heatsink Power Supply

      72
  • 6.4 Thermal Specifications

    73
    • 6.4.1 Boxed Processor Cooling Requirements

      73
• 7.0 Pentium ® II Processor Signal Description

  74
  • 7.1 Alphabetical Signals Reference

    74
  • 7.2 Signal Summaries

    81