Intel SL2YM Manuel D’Utilisation
Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet
73
6.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
processor.
6.4.1
Boxed Processor Cooling Requirements
The boxed processor will be cooled with a fan heatsink. The boxed processor fan heatsink will
keep the processor temperature, within the specifications (see Section 4.0), provided airflow
through the fan heatsink is unimpeded and the air temperature entering the fan is below 45 °C (see
keep the processor temperature, within the specifications (see Section 4.0), provided airflow
through the fan heatsink is unimpeded and the air temperature entering the fan is below 45 °C (see
Figure 43
for measurement location).
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life.
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life.
Figure 43
illustrates an acceptable airspace clearance for the fan heatsink.
Figure 48. Recommended Motherboard Power Header Placement Relative to Fan Power Connector and
Pentium
®
II Processor
Table 40. Motherboard Fan Power Connector Location
Fig. Ref. Labels
Dimensions (Inches)
Min
Typ
Max
V
Aproximate perpendicular distance of the fan power
connector from the center of the 242-contact slot connector
connector from the center of the 242-contact slot connector
1.44
W
Aproximate parallel distance of the fan power connector
from the edge of the 242-contact slot connector
from the edge of the 242-contact slot connector
1.45
X
Lateral distance of the motherboard fan power header
location from the fan power connector
location from the fan power connector
4.75