Cypress CY7C1347G Manuel D’Utilisation
CY7C1347G
Document #: 38-05516 Rev. *F
Page 10 of 22
I
SB3
Automatic CE
Power Down
Current—CMOS Inputs
Power Down
Current—CMOS Inputs
Max. V
DD
, Device Deselected, or
V
IN
< 0.3V or V
IN
> V
DDQ
– 0.3V
f = f
MAX
= 1/t
CYC
4 ns cycle, 250 MHz
105
mA
5 ns cycle, 200 MHz
95
mA
6 ns cycle, 166 MHz
85
mA
7.5 ns cycle, 133 MHz
75
mA
I
SB4
Automatic CE
Power Down
Current—TTL Inputs
Power Down
Current—TTL Inputs
Max. V
DD
, Device Deselected,
V
IN
≥ V
IH
or V
IN
≤ V
IL
, f = 0
45
mA
Electrical Characteristics
(continued)
Over the Operating Range
[8, 9]
Parameter
Description
Test Conditions
Min
Max
Unit
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Max
119 BGA
Max
165 FBGA
Max
Unit
C
IN
Input
Capacitance
T
A
= 25
°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 3.3V
5
5
5
pF
C
CLK
Clock Input Capacitance
5
5
5
pF
C
IO
Input/Output Capacitance
5
7
7
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Package
119 BGA
Package
Package
165 FBGA
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
30.32
34.1
20.3
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
(Junction to Case)
6.85
14.0
4.6
°C/W
AC Test Loads and Waveforms
Figure 4. AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 1667
Ω
R = 1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
V
T
= 1.5V