Emerson MVME55006E Manuel D’Utilisation
Component Temperature Measurement
Thermal Validation
MVME55006E Single-Board Computer Installation and Use (6806800A37D)
101
B.3
Component Temperature Measurement
The following sections outline general temperature measurement methods. For the specific
types of measurements required for thermal evaluation of this board, see
types of measurements required for thermal evaluation of this board, see
B.3.1
Preparation
We recommend 40 AWG (American wire gauge) thermocouples for all thermal measurements.
Larger gauge thermocouples can wick heat away from the components and disturb air flowing
past the board.
Larger gauge thermocouples can wick heat away from the components and disturb air flowing
past the board.
Allow the board to reach thermal equilibrium before taking measurements. Most circuit boards
will reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small
number of components over time to assure that equilibrium has been reached.
will reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small
number of components over time to assure that equilibrium has been reached.
Figure B-2
Thermally Significant Components—Primary Side
J34
4436 0207
COM1
ABT/RST
10/100
CPU
BFL
ENET
2
ENET
1
J5
J18
J27
J28
U22
J8
J3
J1
J2
P4
J13
J14
J11
J12
J23
J24
J21
J22
P1
P2
U25
U16
U19
GigE
PMC 1
PMC 2
J6 / J100
J98
J99
J97
J33
J32
J4
U8
U10
U11
U12
U20
U9
U17
U15
U129
U23
U27
U2
U3
U13
U14
U4
U5
U6
U7
U26
U1
U18
U28
U29
U30
J101 / J7
U31
U24
U124
U123
J102 - J110
U125
U126
J102 - J110
1
3
J32
1
3
J28
1
3
XU2
XU1
S3
S4
S5
S2
S1