Emerson MVME55006E Manuel D’Utilisation

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MVME55006E Single-Board Computer Installation and Use (6806800A37D)
Thermal Validation
Measuring Junction Temperature
102
   
B.3.2
Measuring Junction Temperature
Some components have an on-chip thermal measuring device such as a thermal diode. For 
instructions on measuring temperatures using the on-board device, refer to the component 
manufacturer’s documentation listed in 
.
B.3.3
Measuring Local Air Temperature
Measure local component ambient temperature by placing the thermocouple downstream of 
the component. This method is conservative since it includes heating of the air by the 
component. The following figure illustrates one method of mounting the thermocouple.
B.3.4
Measuring Case Temperature
Measure the case temperature at the center of the top of the component. Make sure there is 
good thermal contact between the thermocouple junction and the component. We recommend 
you use a thermally conductive adhesive such as Loctite 384.
If components are covered by mechanical parts such as heatsinks, you will need to machine 
these parts to route the thermocouple wire. Make sure that the thermocouple junction contacts 
only the electrical component. Also make sure that heatsinks lay flat on electrical components. 
The following figure shows one method of machining a heatsink base to provide a 
thermocouple routing path.
Figure B-3
Thermalcouple Placement
Thermocouple 
junction
PWB
Tape thermocouple wire to 
top of component
Air flow