Intel 2 Duo T9500 EC80576GG0646M Manuel D’Utilisation
Codes de produits
EC80576GG0646M
Thermal Specifications
72
Datasheet
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to
for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than
TDP in HFM.
TDP in HFM.
6.
At Tj of 105
o
C
7.
At Tj of 50
o
C
8.
At Tj of 35
o
C
Table 16.
Power Specifications for Dual-Core Standard Voltage Processors
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
T9500
T9300
T8300
T8100
T9300
T8300
T8100
2.6 GHz & V
CCHFM
2.5 GHz & V
CCHFM
2.4 GHz & V
CCHFM
2.1 GHz & V
CCHFM
1.2 GHz & V
CCLFM
0.8 GHz & V
CCLFM
35
35
35
35
22
12
35
35
35
22
12
W
1, 4,
5, 6
Symbol
Parameter
Min Typ Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
CCHFM
at V
CCSLFM
—
—
12.5
5.0
W
2, 5, 7
P
SLP
Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
11.8
4.8
W
2, 5, 7
P
DSLP
Deep Sleep Power
at V
CCHFM
at V
CCSLFM
—
—
5.5
2.2
2.2
W
2, 5, 8
P
DPRSLP
Deeper Sleep Power
—
—
1.7
W
2, 8
P
DC4
Intel® Enhanced Deeper Sleep State Power
—
—
1.3
W
2, 8
P
C6
Deep Power-Down Technology Power
—
—
0.3
W
2, 8
T
J
Junction Temperature
0
—
105
°C
3, 4