Corsair XMS3 DHX TW3X4G1333C9D Fascicule
Codes de produits
TW3X4G1333C9D
www.corsair.com
The TW3X4G1333C9DHX G is a 4096MByte matched pair of DDR3 SDRAM DIMMs built using
Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This
part delivers outstanding performance in the latest generation of dual-channel DDR3-based
motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1333MHz at the
low latencies of 9-9-9-24.
TW3X4G1333C9DHX G
Those users installing 4GB or more of memory may notice the total amount of available memory being less than 4GB. The amount available depends on the system configuration and the
way the operating system addresses physical memory. Every part is tested in Corsair's factory at 1333MHz, but your actual results may vary depending on the overclocking margin of
your CPU and motherboard. Newer motherboards may be used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same
or greater performance. RAM used on the module may change without notice. © January 2008 Corsair Memory, Inc.
way the operating system addresses physical memory. Every part is tested in Corsair's factory at 1333MHz, but your actual results may vary depending on the overclocking margin of
your CPU and motherboard. Newer motherboards may be used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same
or greater performance. RAM used on the module may change without notice. © January 2008 Corsair Memory, Inc.
FEATURES
4096 Megabytes of DDR3 memory
Two matched CM3X2G1333C9DHX G
modules
Designed for 64-bit operating systems
Using DHX technology providing
maximum cooling
100% tested at 1333MHz in high performance
DDR3 motherboards
Lifetime warranty
TEST SPECS
Each module pair is tested together at
1333MHz
Tested and packaged in pairs
Packaged together immediately following
system test
Tested together at 1333MHz, Vdimm =
1.70V, at latency settings of 9-9-9-24
SPD programmed at:
JEDEC standard 7-7-7-20 values at
1066MHz
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
Designed for 64-bit Operating Systems