Avnet Inc AVTEG001 Manuel D’Utilisation
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
9 Soldering and Cleaning Recommendations
9.1 Optimum Soldering Reflow Profile
Figure 9
– Recommended Soldering Profile for Lead-Free Solder
Solder joint quality between
the module’s LGA surface mount pads and their bonding with the host
board should meet the appropriate IPC Specification.
(See IPC-A-610-D Acceptability of Electronic Assemblies
(See IPC-A-610-D Acceptability of Electronic Assemblies
, section 8.2.1 “Bottom Only Terminations”)
It is recommended that only a single reflow soldering process be permitted for the host board
Any attempts at reworking the module will invalidate warrantee coverage and regulatory certifications
9.2 Cleaning
Cleaning of the populated module is not recommended! Residuals under the module cannot be easily
removed by any cleaning process (Water / Solvents / Ultrasonic)
removed by any cleaning process (Water / Solvents / Ultrasonic)