Manuels d'utilisation pour Avnet Inc AVTEG001

Table des matières

• Table of Figures

  5
• Functional Overview

  6
• Microcontroller

  6
• SPI Flash Memory

  6
• WLAN

  7
• Bluetooth

  7
• Antennas

  7
• Block Diagram

  8
• Module Pin Descriptions

  9
• Pin Descriptions

  9
• Pin Definitions

  10
• Electrical Specifications

  11
• Absolute Maximum Ratings

  11
• Recommended Operating Conditions

  11
• Power Supply Requirements

  11
• WLAN Power Consumption

  12
• Bluetooth Power Consumption

  12
• Bluetooth Low Energy Power Consumption

  12
• Low Power Modes Power Consumption

  12
• RF Specifications

  13
• WLAN RF Characteristics

  13
• Transmitter Specification

  14
• Receiver Specification

  15
• Bluetooth RF Characteristics

  17
• Transmitter Specification

  17
• Receiver Specification

  17
• BLE RF Characteristics

  18
• Mechanical Specifications

  19
• Mechanical Size

  19
• Module PCB Footprint

  20
• Module Pad Size

  20
• Recommended Solder Paste Mask

  21
• Recommended Solder Mask

  21
• Tape and Reel Packaging

  22
• Soldering and Cleaning Recommendations

  23
• Optimum Soldering Reflow Profile

  23
• Cleaning

  23
• 10 Antennas

  24
• 11 Certifications

  25
• RoHS

  25
• Regulatory Compliance

  25
• Bluetooth Interoperability Compliance

  25
• Regulatory Agency Statements

  25
• OEM Instructions

  26
• OEM Labeling Requirements

  26
• Limitations

  26
• 12 Shipping, Handling and Storage

  27
• Shipping

  27
• Handling

  27
• Moisture Sensitivity (MSL)

  27
• Storage

  27
• 13 Ordering Information

  28
• Module Accessories

  28
• 14 Contact Information

  29
• Figure 1 – AES-BCM4343W-M1-G Module Block Diagram

  8
• Figure 2 – AES-BCM4343W-M1-G Module Top View

  19
• Figure 3 – AES-BCM4343W-M1-G Module Side View

  19
• Figure 4 – AES-BCM4343W-M1-G Module PCB Footprint

  20
• Figure 5 – AES-BCM4343W-M1-G Module Pad Size

  20
• Figure 6 – Recommended Solder Paste Mask Size

  21
• Figure 7 – Recommended Solder Mask Size

  21
• Figure 8 – Tape Dimensions

  22
• Figure 9 – Recommended Soldering Profile for Lead-Free Solder

  23
• Figure 10 – Dual Fractal PCB Antennas

  24
• Figure 11 – Test Probe Connectors (Murata SWD series)

  24