Intel 200 MHz FV8050366200 Manuel D’Utilisation
Codes de produits
FV8050366200
PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY
E
50
5/23/97 10:47 AM 24318502.DOC
INTEL CONFIDENTIAL
(until publication date)
Table 21. Thermal Resistances for PPGA Packages
Heat Sink Height
θ
JC
θ
CA
(°C/Watt) vs. Laminar Airflow (linear ft/min)
(inches)
(°C/Watt)
0
100
200
400
600
800
0.25
0.4
8.9
7.8
6.4
4.3
3.4
2.8
0.35
0.4
8.6
7.3
5.8
3.8
3.1
2.6
0.45
0.4
8.2
6.8
5.1
3.4
2.7
2.3
0.55
0.4
7.9
6.3
4.5
3.0
2.4
2.1
0.65
0.4
7.5
5.8
4.1
2.8
2.2
1.9
0.80
0.4
6.8
5.1
3.7
2.6
2.0
1.8
1.00
0.4
6.1
4.5
3.4
2.4
1.9
1.6
1.20
0.4
5.7
4.1
3.1
2.2
1.8
1.6
1.40
0.4
5.2
3.7
2.8
2.0
1.7
1.5
None
1.2
12.9
12.2
11.2
7.7
6.3
5.4
NOTES:
Heatsinks are omni directional pin aluminum alloy.
Features were based on standard extrusion practices for a given height:
Pin size ranged from 50 to 129 mils
Pin spacing ranged from 93 to 175 mils
Based thickness ranged from 79 to 200 mils
Heatsink attach was 0.005" of thermal grease.
Attach thickness of 0.002" will improve performance approximately 0.3ºC/Watt.