Manuels d'utilisation pour Intel 200 MHz

Table des matières

• 1.0. MICROPROCESSOR ARCHITECTURE OVERVIEW

  4
  • 1.1. Pentium® Processor Family Architecture

    5
  • 1.2. Pentium® Processor with MMX™ Technology

    7
    • 1.2.1. FULL SUPPORT FOR INTEL MMX™ TECHNOLOGY

      7
    • 1.2.2. DOUBLE CODE AND DATA CACHES TO 16K EACH

      7
    • 1.2.3. IMPROVED BRANCH PREDICTION

      7
    • 1.2.4. ENHANCED PIPELINE

      7
    • 1.2.5. DEEPER WRITE BUFFERS

      8
  • 1.3. Mobile Pentium® Processor with MMX™ Technology

    8
• 2.0. PINOUT

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  • 2.1. Pinout and Pin Descriptions

    9
    • 2.1.1. PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY PINOUT

      9
    • 2.1.2. PIN CROSS-REFERENCE TABLE FOR PENTIUM® PROCESSOR WITH MMX™

      11
  • 2.2. Design Notes

    13
  • 2.3. Quick Pin Reference

    13
  • 2.4. Pin Reference Tables

    24
  • 2.5. Pin Grouping According to Function

    24
• 3.0. ELECTRICAL SPECIFICATIONS

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  • 3.1. Electrical Characteristics and Differences between the Pentium® Processor with MMX™ Technology and the Pentium Processor 13

    28
    • 3.1.1. POWER SUPPLIES

      28
      • 3.1.1.1. Power Supply Sequencing

        28
    • 3.1.2. CONNECTION SPECIFICATIONS

      28
      • 3.1.2.1. Power and Ground

        28
        • 3.1.2.1.1. VCC2 and VCC3 Measurement Specification

          28
        • 3.1.2.1.2. Decoupling Recommendations

          29
      • 3.1.2.2. 3.3V Inputs and Outputs

        29
      • 3.1.2.3. NC/INC and Unused Inputs

        29
      • 3.1.2.4. Private Bus

        30
    • 3.1.3. BUFFER MODELS

      30
  • 3.2. Absolute Maximum Ratings

    30
  • 3.3. DC Specifications

    31
  • 3.4. AC Specifications

    34
• 4.0. MECHANICAL SPECIFICATIONS

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• 5.0. THERMAL SPECIFICATIONS

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  • 5.1. Measuring Thermal Values

    46
    • 5.1.1. THERMAL EQUATIONS AND DATA

      46