Intel Phi 7120A SC7120A Fiche De Données
Codes de produits
SC7120A
Document ID Number: 328209 003EN
Intel
®
Xeon Phi™ Coprocessor Datasheet
35
3.4.3
Mechanical Considerations
• In the passive Intel
®
Xeon Phi™ coprocessor products, the only component on the
card with IHS load is the coprocessor. The compressive load is assumed to be
approximately uniformly distributed over the IHS. The minimum load is 23lbf and
maximum load is 75lbf. The mean pressure on the IHS is 33lbf.
approximately uniformly distributed over the IHS. The minimum load is 23lbf and
maximum load is 75lbf. The mean pressure on the IHS is 33lbf.
• Hitachi Type7 is recommended as the thermal interface material (TIM).
• The gap filler used is the Bergquist 3500S35.
• The Intel passive heat sink is designed to nominal gaps of
• The gap filler used is the Bergquist 3500S35.
• The Intel passive heat sink is designed to nominal gaps of
— GDDR: 0.3 +/- 0.1225 mm
— VR FETs: 0.511 +/- 0.1225 mm
— VR Inductors: 0.5 +/- 0.2 mm
— VR FETs: 0.511 +/- 0.1225 mm
— VR Inductors: 0.5 +/- 0.2 mm
shows the maximum heights of the different components on the SE10X/
show the front and back sides of the SE10X/7120X
SKU. Refer to the Intel
®
Xeon Phi™ Coprocessor Thermal Mechanical Models document
for the SE10X/7120X SKU. Refer to the Intel
®
Xeon Phi™ Coprocessor Dense Form
Factor Models document for information on 5120D SKU.
Table 3-4.
Board Component Heights
Block
Color
1
Notes:
1. Colors are in reference to
and
Component Height (mils)
Min
Typ
Max
PCB Thickness
57
62
70
Coprocessor
171.221
177.992
184.763
GDDR
Orange
47
47.25
VR Inductor
Yellow
217
217
VR phase
controller
Red
35
39.37
Coprocessor VR
controller
Green
37
37
GDDR VR
controller
Pink
35
35.43
Capacitor
topside
Purple
49
49
Capacitor
backside
Light blue
83
83