Intel Phi 7120A SC7120A Data Sheet

Product codes

SC7120A

Document ID Number: 328209 003EN

Intel

Xeon Phi™ Coprocessor Datasheet

3.4.3

Mechanical Considerations

• In the passive Intel

Xeon Phi™ coprocessor products, the only component on the

card with IHS load is the coprocessor. The compressive load is assumed to be
approximately uniformly distributed over the IHS. The minimum load is 23lbf and
maximum load is 75lbf. The mean pressure on the IHS is 33lbf.

• Hitachi Type7 is recommended as the thermal interface material (TIM).
• The gap filler used is the Bergquist 3500S35.
• The Intel passive heat sink is designed to nominal gaps of

— GDDR: 0.3 +/- 0.1225 mm
— VR FETs: 0.511 +/- 0.1225 mm
— VR Inductors: 0.5 +/- 0.2 mm

Table 3-4

shows the maximum heights of the different components on the SE10X/

7120X and 7120D/5120D products, along with the heights used in the product board
design.

Figure 3-18

and

Figure 3-19

show the front and back sides of the SE10X/7120X

SKU. Refer to the Intel

Xeon Phi™ Coprocessor Thermal Mechanical Models document

for the SE10X/7120X SKU. Refer to the Intel

Xeon Phi™ Coprocessor Dense Form

Factor Models document for information on 5120D SKU.

Table 3-4.

Board Component Heights

Block

Color

Notes:

1. Colors are in reference to

and

Component Height (mils)

Min

Typ

Max

PCB Thickness

Coprocessor

171.221

177.992

184.763

GDDR

Orange

47.25

VR Inductor

Yellow

217

VR phase

controller

Red

39.37

Coprocessor VR

controller

Green

GDDR VR

controller

Pink

35.43

Capacitor

topside

Purple

Capacitor

backside

Light blue