STMicroelectronics M24C64-WBN6P Memory IC M24C64-WBN6P Fiche De Données
Codes de produits
M24C64-WBN6P
DocID16891 Rev 28
M24C64-W M24C64-R M24C64-F
41
Figure 20. WLCSP 5-bump wafer-length chip-scale package outline
(M24C64-FCS6TP/K)
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 22. WLCSP 5-bump wafer-length chip-scale package mechanical data
(M24C64-FCS6TP/K)
Symbol
millimeters
inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.545
0.490
0.600
0.0215
0.0193
0.0236
A1
0.190
0.0075
A2
0.355
0.0140
b
(2)
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
0.270
0.0106
D
0.959
1.074
0.0378
0.0423
E
1.073
1.168
0.0422
0.0460
e
0.693
0.0273
e1
0.400
0.0157
e2
0.3465
0.0136
F
0.280
0.0110
G
0.190
0.0075
aaa
0.110
0.0043
eee
0.060
0.0024
Bump
Detail A
rotated by 90°
rotated by 90°
Wafer back side
Side view
Detail A
Bump side
A
A2
e1
e2
e
C
B
A
1
2
3
G
F
A1
D
E
b
1Cd_ME
Index
Index