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© 2007-2011 Microchip Technology Inc.
DS70290J-page 255
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
TABLE 23-4:
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
)
TABLE 23-5:
DC CHARACTERISTICS: OPERATING CURRENT (I
DD
)
TABLE 23-6:
DC CHARACTERISTICS: DOZE CURRENT (I
DOZE
)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
-40°C 
≤ T
A
 
≤ +150°C for High Temperature
Parameter 
No.
Typical
Max
Units
Conditions
Power-Down Current (I
PD
)
(3)
HDC60e
250
2000
μA
+150°C
3.3V
Base Power-Down Current
(1,3)
HDC61c
3
5
μA
+150°C
3.3V
Watchdog Timer Current: 
ΔI
WDT(2,4)
Note 1: Base I
PD
 is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and 
pulled to V
SS
. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
2: The 
Δ current is the additional current consumed when the module is enabled. This current should be 
added to the base I
PD
 current.
3: These currents are measured on the device containing the most memory in this family.
4: These parameters are characterized, but are not tested in manufacturing.
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
-40°C 
≤ T
A
 
≤ +150°C for High Temperature
Parameter 
No.
Typical
(1)
Max
Units
Conditions
HDC20
19
35
mA
+150°C
3.3V
10 MIPS
HDC21
27
45
mA
+150°C
3.3V
16 MIPS
HDC22
33
55
mA
+150°C
3.3V
20 MIPS
Note 1: These parameters are characterized, but are not tested in manufacturing.
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
-40°C 
≤ T
A
 
≤ +150°C for High Temperature
Parameter 
No.
Typical
(1)
Max
Doze 
Ratio
Units
Conditions
HDC72a
39
45
1:2
mA
+150°C
3.3V
20 MIPS
HDC72f
18
25
1:64
mA
HDC72g
18
25
1:128
mA
Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.