Linear Technology LTC4226CUD-2 Demoboard : Dual Hot Swap Controller with Auto-Retry DC1627A-B DC1627A-B Fiche De Données

Codes de produits
DC1627A-B
Page de 24
LTC4226
22
4226f
package DescripTion
Please refer to 
http://www.linear.com/designtools/packaging/
 for the most recent package drawings.
3.00 
±0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 
±0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 
    MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
    ON THE TOP AND BOTTOM OF PACKAGE  
PIN 1
TOP MARK
(NOTE 6)
0.40 
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 
±0.10
(4-SIDES)
0.75 
±0.05
R = 0.115
TYP
0.25 
±0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 
× 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 
±0.05
3.50 
±0.05
0.70 
±0.05
0.00 – 0.05
(UD16 VAR A) QFN 1207 REV A
0.25 
±0.05
0.50 BSC
PACKAGE OUTLINE
UD Package
16-Lead Plastic QFN (3mm 
× 3mm)
(Reference LTC DWG # 05-08-1700 Rev A)
Exposed Pad Variation AA