Linear Technology LTC4226CUD-2 Demoboard : Dual Hot Swap Controller with Auto-Retry DC1627A-B DC1627A-B Fiche De Données

Codes de produits
DC1627A-B
Page de 24
LTC4226
23
4226f
Information  furnished  by  Linear  Technology  Corporation  is  believed  to  be  accurate  and  reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to 
http://www.linear.com/designtools/packaging/
 for the most recent package drawings.
MSOP (MS16) 1107 REV Ø
0.53 
± 0.152
(.021 
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1 2 3 4 5 6 7 8
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
    MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
    INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 
± 0.127
(.035 
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 
± 0.038
(.0120 
± .0015)
TYP
0.50
(.0197)
BSC
4.039 
± 0.102
(.159 
± .004)
(NOTE 3)
0.1016 
± 0.0508
(.004 
± .002)
3.00 
± 0.102
(.118 
± .004)
(NOTE 4)
0.280 
± 0.076
(.011 
± .003)
REF
4.90 
± 0.152
(.193 
± .006)
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)