On Semiconductor NCV8873 Evaluation Board NCV8873LEDBSTGEVB NCV8873LEDBSTGEVB Fiche De Données

 (Voltages are with respect to GND, unless otherwise indicated)

Dc Supply Voltage (VIN)

−0.3 to 40

V

Peak Transient Voltage (Load Dump on VIN)

45

V

Dc Supply Voltage (VDRV, GDRV)

12

V

Peak Transient Voltage (VFB)

−0.3 to 6

V

Dc Voltage (VC, VFB, ISNS)

−0.3 to 3.6

V

Dc Voltage (EN/SYNC)

−0.3 to 6

V

Dc Voltage Stress (VIN − VDRV)*

−0.7 to 40

V

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−65 to 150

°C

Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C

265 peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*An external diode from the input to the VIN pin is required if bootstrapping VDRV and VIN off of the output voltage.

ESD Capability (All Pins)

 Human Body Model

Machine Model

 w2.0

w200

KV

V

Moisture Sensitivity Level

1

Package Thermal Resistance

Junction−to−Ambient, R

qJA

100

°C/W

1. 1 in

2

, 1 oz copper area used for heatsinking.

The NCV8873 features several variants to better fit a

multitude of applications. The table below shows the typical

values of parameters for the parts that are currently
available.

NCV887300

86.5%

1000 kHz

1.6 ms

130 mV/ms

400 mV

800 mA

600 mA

6.3 V

D

max

Maximum duty cycle

f

s

Switching frequency

t

ss

Soft−start time

S

a

Slope compensating ramp

V

cl

Current limit trip voltage

I

src

Gate drive sourcing current

I

sink

Gate drive sinking current

V

DRV

Drive voltage