Intel E3-1105C AV8062701048800 Fiche De Données
Codes de produits
AV8062701048800
Processor SKUs
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012
Datasheet - Volume 1 of 2
Document Number: 327405
-
001
45
5.0
Processor SKUs
5.1
Overview
This section details the features of the various SKUs of the Intel
®
Xeon
®
and Intel
®
Core™ Processors for Communications Infrastructure. The mix of SKUs are chosen to
span cost, performance, temperature environment and power consumption.
5.1.1
SKU Features
outlines the processor SKUs available.
§ §
Table 5-1.
Base Features by SKU
Intel
®
Xeon
®
and Intel
®
Core™ Processors for Communications Infrastructure
Product Name
Intel
®
Xeon
®
Processor
E3-1125C
Intel
®
Xeon
®
Processor
E3-1105C
Intel
®
Core™
i3 Processor
2115C
Intel
®
Pentium
®
Processor
B915C
Intel
®
Celeron
®
Processor
725C
Target Core Speed (GHz)
2.0
1.0
2.0
1.5
1.3
Active Cores
4
4
2
2
1
TDP
(Watts)
40
25
25
15
10
Die Type
4 Core
4 Core
2 Core
2 Core
2 Core
L3 Cache (MB)
8
6
3
3
1.5
Memory Channels
2
2
2
2
1
ECC Memory
Yes
PCI-Express* (lanes)
20
16
PCI-Express* (root)
1x16 +1x4 or 2x8 +1x4 or 1x8 +3x4
1x16 or 2x8 or
1x8 +2x4
Junction Temperature
T
J-Min
= 0
o
C, T
J-MAX
= 100
o
C
Intel
®
Virtualization Technology
Yes
Intel
®
Hyper-Threading
Technology
Yes
Intel
®
Trusted Execution
Technology
No
Graphics
No
Intel
®
Turbo Boost
No
Note:
1.
Thermal Design Power (TDP) is a system design target associated with the maximum component operating
temperature specifications. TDP values are determined based on typical DC electrical specification and
maximum component temperature for a realistic-case application running at maximum utilization.