Intel E3-1105C AV8062701048800 Ficha De Dados

Intel

®

 Xeon

®

 and Intel

®

 Core™ Processors For Communications Infrastructure

May 2012

Datasheet - Volume 1 of 2

Document Number: 327405

-

001

45

This section details the features of the various SKUs of the Intel

Core™ Processors for Communications Infrastructure. The mix of SKUs are chosen to 

span cost, performance, temperature environment and power consumption. 

 outlines the processor SKUs available.

Target Core Speed (GHz)

2.0

1.0

2.0

1.5

1.3

Active  Cores

4

4

2

2

1

TDP

 

(Watts)

40

25

25

15

10

Die Type

4 Core

4 Core

2 Core

2 Core

2 Core

L3 Cache (MB)

8

6

3

3

1.5

Memory Channels

2

2

2

2

1

ECC Memory

Yes

PCI-Express* (lanes)

20

16

PCI-Express* (root)

1x16 +1x4 or 2x8 +1x4 or 1x8 +3x4

1x16 or 2x8 or

1x8 +2x4

Junction Temperature

T

J-Min

 = 0

o

C, T

J-MAX

 = 100

o

C

Intel

®

 Virtualization Technology

Yes

Intel

®

 Hyper-Threading 

Technology

Yes

Intel

®

 Trusted Execution 

Technology

No

Graphics

No

Intel

®

 Turbo Boost

No

1.

Thermal Design Power (TDP) is a system design target associated with the maximum component operating 

temperature specifications. TDP values are determined based on typical DC electrical specification and 

maximum component temperature for a realistic-case application running at maximum utilization.