Intel X7460 AD80582KH067007 Fiche De Données
Codes de produits
AD80582KH067007
Thermal Specifications
90
Intel® Xeon® Processor 7400 Series Datasheet
enabled 2U heatsink). In this scenario, it is expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most
power intensive applications. Intel has developed the thermal profile to allow
customers to choose the thermal solution and environmental parameters that best suit
their platform implementation. Refer to the Intel® Xeon® Processor 7400 Series
Thermal Mechanical Design Guide for details on system thermal solution design,
thermal profiles and environmental considerations.
(TCC) would only be activated for very brief periods of time when running the most
power intensive applications. Intel has developed the thermal profile to allow
customers to choose the thermal solution and environmental parameters that best suit
their platform implementation. Refer to the Intel® Xeon® Processor 7400 Series
Thermal Mechanical Design Guide for details on system thermal solution design,
thermal profiles and environmental considerations.
) supports a single Thermal
Profile. The Thermal Profiles are indicative of a constrained thermal environment
(Ex: 1U form factor). Because of the reduced cooling capability represented by this
solution, the probability of TCC activation and performance loss is increased.
Additionally, utilization of a thermal solution that does not meet the Thermal Profile will
violate the thermal specifications and may result in permanent damage to the
processor. Refer to the Intel® Xeon® Processor 7400 Series Thermal Mechanical
Design Guide for details on system thermal solution design, thermal profiles and
environmental considerations.
(Ex: 1U form factor). Because of the reduced cooling capability represented by this
solution, the probability of TCC activation and performance loss is increased.
Additionally, utilization of a thermal solution that does not meet the Thermal Profile will
violate the thermal specifications and may result in permanent damage to the
processor. Refer to the Intel® Xeon® Processor 7400 Series Thermal Mechanical
Design Guide for details on system thermal solution design, thermal profiles and
environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
the associated T
CASE
value. It should be noted that the upper point associated with
Intel® Xeon® X7460 Processor Thermal Profile (x = TDP and y = T
CASE_MAX
P @ TDP)
represents a thermal solution design point. In actuality the processor case temperature
will not reach this value due to TCC activation (see
will not reach this value due to TCC activation (see
for the Intel® Xeon®
X7460 Processor).
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Intel Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Intel Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
power dissipation is currently planned. Intel Thermal Monitor or Intel Thermal
Monitor 2 feature must be enabled for the processor to remain within its
specifications.
power dissipation is currently planned. Intel Thermal Monitor or Intel Thermal
Monitor 2 feature must be enabled for the processor to remain within its
specifications.