Intel X7460 AD80582KH067007 Fiche De Données
Codes de produits
AD80582KH067007
Intel® Xeon® Processor 7400 Series Datasheet
91
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
. The Intel® Xeon® Processor 7400 Series
may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to
discrete points that constitute the thermal profile.
Table 6-1.
Processor Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Intel® Xeon® X7460
Processor Launch to FMB
130
5
;
1, 2, 3, 4, 5
Intel® Xeon® Processor
E7400 Series Launch to
FMB
90
5
See
;
;
1, 2, 3, 4, 5
6-core Intel® Xeon®
Processor L7400 Series
Launch to FMB
65
5
See
;
;
1, 2, 3, 4, 5
4-core Intel® Xeon®
Processor L7400 Series
Launch to FMB
50
5
1, 2, 3, 4, 5
Figure 6-1. Intel® Xeon® X7460 Processor Thermal Profile
30
35
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Power (W)
Te
m
p
er
at
u
re
(C
)
T
CASE
= 0.146 x Power + 45
o
C