Manuels d'utilisation pour HTC Rev. A05

Table des matières

• Diamond

  1
• Service Manual

  1
• UHTC Proprietary

  1
• Confidential Treatment Requested

  1
• Rev. A05

  1
• HTC Corporation

  1
• Engineering Mobility

  1
• REVISION CONTROL TABLE

  2
• REV

  2
• DATE

  2
• CONTENTS

  2
• DEPT

  2
• REVISED

  2
• STAGE

  2
• AX01

  2
• 2008/04/14

  2
• Fist Draft

  2
• PSE

  2
• Steven Liu

  2
• CVT

  2
• A01

  2
• 2008/5/9

  2
• 1. Modify product overview

  2
• 2. Add RF spec

  2
• 3. Add pre-load process

  2
• PSE

  2
• Steven Liu

  2
• MV

  2
• A02

  2
• 2008/5/29

  2
• 1. Modify the pre-load process in chapter 4

  2
• 2. Modify ESPL material P/N

  2
• 3.Modify the idle current specification in the page no. 71

  2
• PSE

  2
• Steven Liu

  2
• MP

  2
• A03

  2
• 2008/6/9

  2
• Modify the pre-load process from page no. 53~56

  2
• PSE

  2
• Steven Liu

  2
• MP

  2
• A04

  2
• 2008/6/14

  2
• 1. Modify the specification for G-sensor in the page no. 7

  2
• 2. Remove the matrix table in the pre-load process

  2
• PSE

  2
• Steven Liu

  2
• MP

  2
• A05

  2
• 2008/6/21

  2
• 1. Modify the disassembly process in page no.23, 24

  2
• and 30

  2
• 2. Modify the pre-load process from page no. 53~57

  2
• 3. Modify the SPL list in Chapter 9.1

  2
• 4. Modify main board current leakage test procedure in

  2
• the chapter No.5

  2
• PSE

  2
• Steven Liu

  2
• MP

  2
• Table of Contents

  3
• 1. INTRODUCTION 4

  3
• 1.1 Product Features 5

  3
• 1.2 Product overview 12

  3
• 2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE 18

  3
• 2.1 Tools List 18

  3
• 2.2 Disassembling procedure 18

  3
• 2.3 Assembling procedure 32

  3
• 3. ROM RE-FLASH PROCEDURE 46

  3
• 3.1 ROM upgrade thru RUU (Re-flash Upgrade Utility) 46

  3
• 3.2 Rom Image upgrade thru SD card 49

  3
• 4. DIAGNOSTIC PROGRAM 51

  3
• 4.1 List of Diagnostic / WinCE Test Items 52

  3
• 5. POWER MEASUREMENT TEST 70

  3
• 5.1 Main board leakage current Test Procedure 70

  3
• 5.2 Battery rundown test procedure 74

  3
• 6. COSMETIC INSPECTION CRITERIA 79

  3
• 6.1 Classes definition of inspective area 79

  3
• 6.2 Display inspection 80

  3
• 6.3 Main unit inspection 81

  3
• 7. GENERIC TROUBLESHOOTING 82

  3
• 8. GENERIC LABELING PLAN 87

  3
• 9. GENERIC SPARE PART LIST AND PHOTOS 96

  3
• 9.1 SPL for Repair 96

  3
• 9.2 Board Level 2.5 Repairs 102

  3
• 10. RF ANTENNA SPECIFICATION 108

  3
• 1. Introduction

  4
• This manual provides the technical information to support the service activities of Diamond.

  4
• This document contains highly confidential information, so any or all of this document should not be revealed to any third party.

  4
• Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After reading this chapter, you will know what feature the product has and basic hardware operation. Also you will know how to perform soft-rest and hard-rest in this chapter.

  4
• Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter, you will learn how to disassemble and assemble the product. Also, you will know what tools to use and the torque. Please follow the instruction to dissemble the unit to prevent from damaging the unit.

  4
• Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of enter the boot loader mode.

  4
• Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn

  4
• How to use the diagnostic program to perform unit function test

  4
• How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and USB etc)

  4
• Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB leakage test procedure and battery run-down test (Battery Capacity Measurement).

  4
• Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance quality inspection criteria, ex. Display, bezel, and housing etc

  4
• Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic trouble-shooting.

  4
• Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex. Regulation label, and battery label etc

  4
• Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference list and photos for repairing, including unit and Board level.

  4
• Chapter 10: RF Antenna Specification- Reference Spec for RF test.

  4
  • 1.1 Product Features

    5
• Platform

  5
• Ultra slim bar type PDA phone form factor

  5
• Microsoft Windows Mobile 6.1 professional

  5
• Dimension

  5
• 102 mm(L) x 51 mm(W) x 11.5 mm(T)

  5
• [W/ 900mAH battery]

  5
• Processor/Chipset

  5
• Qualcomm MSM 7201A, 528 MHz

  5
• Memory

  5
• ROM: 256 MB (for programs and users storage)

  5
• NAND: 4 GB

  5
• RAM: 196 MB DDR RAM (include 64MB memory in

  5
• baseband)

  5
• LCD Module

  5
• 2.8" VGA dots resolution

  5
• 64K-color TFT LCD with LED back light

  5
• Touch Screen

  5
• HSDPA/WCDMA/EDGE/GPRS/GSM Function

  5
• Internal antenna

  5
• HSDPA/UMTS (2100/900 MHz for EU, Asia and Softbank, 850/1900 for US, Latin America SKU3, 2100/850 for Telstra, Latin America SKU1&SKU2) and GSM/GPRS/EDGE Tri-band (900/1800/1900Mhz for EU, Asia, Softbank, E-Mobile, Telstra, Latin America SKU2 and 850/1800/1900 for US, Latin America SKU1&3)

  5
• HSDPA/UMTS

  5
• 850: 824-849 MHz, 869-894 MHz (Band V)

  5
• 900: 880-915 MHz, 925-960 MHz (Band VIII)

  5
• 1900:1850-1910MHz, 1930-1990MHz (Band II)

  5
• 2100:1920-1980MHz, 2110-2170MHz (Band I)

  5
• GSM/GPRS/EDGE Tri-band

  5
• 850: 824-849, 869-894MHz

  5
• 900: 880-915, 925-960MHz

  5
• 1800: 1710-1785, 1805-1880MHz

  5
• 1900: 1850-1910, 1930-1990MHz

  5
• HSDPA / UMTS

  5
• 3GPP Release 5 compliant

  5
• Up to 3.6/7.2Mbps peak rate

  5
• HSUPA [Option, depends on carrier engagement]

  5
• Category 5, 2Mbps

  5
• Concurrent: DL up to 3.6Mbs and UL up to 2Mbps

  5
• Global roaming

  5
• Auto band switching

  5
• Handover and cell selection between

  5
• GSM/GPRS/EDGE and UMTS

  5
• DTM

  5
• SAIC (circuit switch only)

  5
• Equalizer (HSDPA channels only)

  5
• Audio codec: AMR-NB, AMR-WB, EFR, FR, HR

  5
• SMS (MO, MT), concatenated SMS (640 characters)

  5
• Support MCC-MNC-UC-ID as stated in 3GPP TS

  5
• 25.401 R99, section 6, for both RIL and radio

  5
• Generic services:

  5
• Call holding/waiting/forwarding

  5
• Call barring

  5
• CLI (Calling Line Identity)

  6
• Display own number

  6
• Network selection

  6
• Cell broadcast

  6
• Multi-party conference call

  6
• Spool icon

  6
• Phase 2+ unstructured supplementary service data

  6
• Network Lock

  6
• CPHS (partial support)

  6
• EGPRS Functionality

  6
• EGPRS class B

  6
• Multi-slot standard class 10

  6
• PBCCH

  6
• Link Adaptation and Incremental Redundancy

  6
• USIM/SIM

  6
• 1.8/3V of UICC

  6
• USIM Application at least according to 3GPP TS

  6
• SIM Application Tool Kit release 96 complete, 98

  6
• class 3, and 99 partial

  6
• Over the Air (OTA) programming

  6
• FDN

  6
• ADN

  6
• Security Pin 1 & 2 control

  6
• EAP-SIM

  6
• Standalone GPS (Qualcomm based solution)

  6
• Internal GPS antenna

  6
• Sensitivity : better than -150dBm for outdoor

  6
• usage

  6
• Support NMEA 0183 version 3.0 or above

  6
• Dynamically allocate parallel channel GPS receiver

  6
• Acquisition time

  6
• Hot start: 8 seconds, typical TTFF (open sky & static

  6
• condition)

  6
• Warm start: 60 seconds, typical TTFF (open sky &

  6
• static condition)

  6
• Cold start: 75 seconds, typical TTFF (open sky &

  6
• static condition)

  6
• Update rate: once/1sec (default)

  6
• GPS Accuracy

  6
• Position: < 15 meters, 95% typical

  6
• Velocity: 0.05 meter/sec steady state

  6
• A-GPS (Qualcomm Based solution)

  6
• Support UE-Based & UE-Assisted A-GPS

  6
• OMA SUPL v1.0 compliance (v2.0 if available)

  6
• SUPL-RRLP

  6
• SUPL-RRC (optional) (TBD)

  6
• WAP push initiated SUPL

  6
• Standard 3GPP A-GPS compliance

  6
• 3GPP TS 44.031 (RRLP 5.12)

  6
• 3GPP TS 25.305 (GSM & UMTS)

  6
• JSR 179 (Location API) support

  6
• Performance requirement

  6
• TTFF (95% successful rate): < 20 seconds

  6
• 2D Location Error (95% successful rate): < 100 m

  6
• Sensitivity requirement

  6
• GPS for one satellite: up to -142dBm

  6
• GPS for remaining satellite: up to -147dBm

  6
• 3GPP TS 25.171 compliance (Requirement for

  6
• support of Assisted Global Positioning System)

  6
• 3GPP 34.171 (Terminal conformance specification,

  6
• Assisted Global Positioning System)

  6
• 3GPP TS 34.108 (Common test environments for

  6
• User Equipment conformance testing)

  6
• Motion G-sensor

  6
• Tri-Axis Accelerometer

  7
• Resolution: 1.22 milli-g

  7
• Auto portrait / landscape mode change when device

  7
• orientation change

  7
• FM Radio

  7
• Turing range: 87.5Mhz ~ 108Mhz

  7
• Frequency space: 100Khz

  7
• Auto channel search

  7
• Digital Camera

  7
• Main camera: (manufacture option)

  7
• 3 mega-pixel camera auto focus

  7
• 2nd camera: (manufacture option)

  7
• Color CMOS VGA camera

  7
• Keyboard/Button/Switch

  7
• Power button (Wake up key)

  7
• Short Press: system on/off

  7
• Long Press: power on/off

  7
• HTC navigator include

  7
• 5-way navigator pad

  7
• Home

  7
• Back / Clear

  7
• Send / hands-free

  7
• - Long press during the call: handsfree on/off

  7
• End

  7
• Volume Up/Down button

  7
• Reset

  7
• Notification

  7
• Notification by sound, vibration, navigator LEDs or

  7
• status shown on the display

  7
• Audio

  7
• Built-in Microphone

  7
• Receiver

  7
• Loud speaker for Hands-Free supported

  7
• Full duplex

  7
• Audio sampling rate

  7
• Recording (uplink): 8-bits or 16-bits with 8KHz,

  7
• 11KHz, 22KHz, 44KHz

  7
• Playback (downlink): 16-bits with 44KHz

  7
• AMR-NB/AMRWB/

  7
• AAC/AAC+/eAAC+/WAV/WMA/MP3 codec

  7
• Audio Path Routing

  7
• Bluetooth

  7
• Receiver

  7
• Speaker

  7
• Headset

  7
• Connectivity & Interface

  7
• Bluetooth

  7
• Compliant with v2.0 with EDR

  7
• Class 2 transmit power

  7
• Supported profiles:

  7
• GAP (generic access profile)

  7
• SPP (serial port profile)

  7
• OPP (object push profile)

  7
• GOEP (generic object exchange profile)

  7
• ActiveSync-Over-Bluetooth

  7
• HSP (headset profile)

  7
• HFP (handsfree profile)

  7
• A2DP (Advanced Audio Distribution profile)

  7
• AVRCP (Audio/Video Remote control Profile)

  7
• HID (Human interface device profile)

  7
• SIM Access Profile

  7
• Service Discovery Application Profile

  7
• BPP (basic printing profile)

  7
• FTP (file transfer profile)

  7
• PAN (personal area networking profile)

  7
• DUN (Dial-up profile)

  7
• PBAP (Phone Book Access Profile)

  7
• Co-exist with WiFi

  8
• WiFi [manufacture option]

  8
• IEEE 802.11b/g compliant

  8
• Internal WLAN antenna

  8
• Data rate auto fallback for extended range

  8
• ELP mode

  8
• Security 802.11i and AES

  8
• WPA2 authentication WEP, WPA2, PSK,

  8
• EAP-TLS, PEAP, LEAP, EAP-SIM

  8
• Signaling interfaces between the terminal

  8
• device and the servers: mutually authenticated

  8
• and encrypted utilizing TLS (RFC 2246) with

  8
• RC4 encryption with SGA1 used as the

  8
• message integrity check

  8
• QoS

  8
• 802.11 WME QoS

  8
• Fast AP to AP handover

  8
• HTC ExtUSB 11-pin mini-USB

  8
• USB 2.0 Client with High / Full Speed

  8
• Audio Jack

  8
• H2W support

  8
• Mass storage support

  8
• 1.8/3V USIM/SIM card slot

  8
• RF connector for testing

  8
• Power

  8
• Battery

  8
• Two removable and rechargeable Lithium ion

  8
• battery sku, 900 mAH

  8
• Charging time: < 3 hours

  8
• Battery life 900mAH

  8
• Playing WMV: 7 hours

  8
• Playing WMA: 10 hours

  8
• Talk time: 2.95 ~ 5.2 hours for GSM

  8
• Talk time: 1.3 ~ 5.2 hours for UMTS

  8
• Video Telephony time: 77~109 minutes

  8
• Standby time: 219~329 hours for GSM

  8
• Standby time: 195 ~ 379 hours for UMTS

  8
• AC adaptor

  8
• AC input: 100 ~ 240V AC, 50/60 Hz

  8
• The device shall be able to detect the AC adapter

  8
• complied with China adapter standard.

  8
• The AC adapter which ship to China shall comply

  8
• with China adapter standard

  8
• DC output: 5V and 1A

  8
• Ambient light sensor

  8
• Stylus

  8
• Lock type mechanism with plug in /out detect and

  8
• magnetic function

  8
• Lanyard Hole

  8
• A lanyard hole allow user to attach various stylish

  8
• pendant to the phone.

  8
• Accessories

  8
• Quick Start Guide [Inbox]

  8
• CD (User manual & Sync. software) [Inbox]

  8
• Screen Protector [Inbox]

  8
• Stylus [Inbox]

  8
• Travel Charger [Inbox]

  8
• USB Sync Cable (mini-USB/USB) [Inbox]

  8
• Battery with battery cover [Inbox]

  8
• Wired Stereo Headset [Inbox]

  8
• Pouch [Inbox]

  8
• 3-in-1 stylus

  8
• 3.5 mm audio adaptor cable with earphone, HS

  8
• U110

  8
• Wired Remote Controller with Earphone, RC E100

  8
• Mono Bluetooth Headset, BH M200

  8
• Stereo Bluetooth Headset, BH S100

  8
• Bluetooth Keyboard

  9
• 4-in-1 multifunction audio cable

  9
• Car Charger

  9
• Car Holder

  9
• 1340mAH extended battery

  9
• Compatibility Test :

  9
• Below accessories are required to do the compatibility test

  9
• Mono Bluetooth Headset, BH M100

  9
• Y-Cable 11 pin to 5pin + 6pin

  9
• Y-Cable 11 pin to 5pin + 3.5 mm Audio Jack

  9
• Y-Cable 11-pin to 5-pin + 2.5 mm Audio Jack

  9
• Handsfree Carkit : Parrot CK3400LS, Parrot MK6100,

  9
• Parrot Minikit, Audi, BMW & Mercedes incar solutions

  9
• Bluetooth Conference: Parrot Conference

  9
• Bluetooth Speaker: Parrot Boombox

  9
• Microsoft Windows Mobile 6 Professional (PPC)

  9
• Applications

  9
• Microsoft Outlook Mobile

  9
• Calendar, Contacts, Messaging (SMS/E-mail),

  9
• Tasks, & Voice Notes, Email Set Up Wizard

  9
• Push Mail

  9
• Microsoft Internet Explorer Mobile

  9
• Microsoft Media Player Mobile

  9
• Microsoft ActiveSync

  9
• Microsoft Windows Mobile Update

  9
• Microsoft Windows Mobile Marketplace

  9
• Internet Sharing

  9
• Picture & Video

  9
• Games

  9
• File Explorer

  9
• Device Management

  9
• Security Enhancement

  9
• Storage Card Encryption, Device Lock

  9
• Microsoft Office Mobile

  9
• Word, Excel & PowerPoint Mobile

  9
• Microsoft Windows Live!

  9
• Windows Live Messenger

  9
• Windows Live Mail (Push Mail)

  9
• Windows Live Contacts

  9
• Windows Live Search

  9
• Windows Live Spaces

  9
• Windows Smart Dialing

  9
• Microsoft Remote Desktop Mobile [optional]

  9
• Value Added Applications

  9
• Camera / Camcorder

  9
• Camera Mode

  9
• Encoding format: JPEG

  9
• Resolution: 2048x1536 (if camera is 3M),

  9
• UXGA 1600x1200, SXGA 1280x960, VGA

  9
• 640x480, QVGA 320x240, QQVGA 160x120

  9
• Night Mode

  9
• Digital Zooming: up to 8x

  9
• Time and Date Stamp

  9
• Camcorder Mode

  9
• 15 fps encoding for QVGA resolution

  9
• Encoding format

  9
• H.263 + AMR-NB

  9
• MPEG4 + AMR-NB

  9
• Ringtone

  9
• MIDI

  9
• 40 polyphonic & Standard MIDI format 0 and 1

  9
• (SMF) / SP MIDI

  9
• MP3, AAC, AAC+, WMA, WAV and AMR-NB

  9
• DirectShow Filters for WMP - Audio

  9
• Audio Playback format: AAC, AAC+, eAAC+, MP3,

  9
• WMA, WAV, AMR, AMR-NB/WB, M4A, AWB, SPMidi

  9
• DirectShow Filters for WMP - Video

  10
• Video Playback format: H.263, MPEG4, WMV,

  10
• Motion JPEG (AVI), H. 264

  10
• Min. 30 fps decoding for H.263 & MPEG4 & H.

  10
• 264@ QVGA resolution

  10
• Video scale up to VGA

  10
• Combined Bit Rate: 64Kbps (playback)

  10
• Picture Enhancement for Pictures & Videos

  10
• Graphics: JPEG, GIF87a, GIF89a, PNG, WBMP

  10
• Video Thumbnail Preview: H.263, MPEG4, and

  10
• Motion JPEG (AVI)

  10
• 3G-324M Video Telephony

  10
• Phone Canvas

  10
• Symbol Table SIP for PPC

  10
• HTC Album

  10
• EZ SIP

  10
• ZIP

  10
• MMS Client

  10
• Partial compliant to MMS 1.2 & MMS 1.3 (When

  10
• available)

  10
• Java virtual machine (J2ME, CLDC 1.1, MIDP 2.0)

  10
• JSR 185 JTWI

  10
• JSR 75 PIM access

  10
• JSR 120 Wireless Messaging API

  10
• JSR 135 Mobile Media API

  10
• Document Viewer - PDF

  10
• OMA DRM Engine: For all types of files (Pictures,

  10
• audio, application etc.), and also all types of delivery

  10
• method (MMS, email etc.)

  10
• OMA 1.0 / 2.0 when available

  10
• Multi-DRM support : MSFT & OMA DRM

  10
• SIM Manager

  10
• Comm. Manager

  10
• STK

  10
• Audio Manager

  10
• Voice Dial & Command

  10
• Voice Recorder (AMR only)

  10
• Task Manager

  10
• Backup Tool

  10
• TouchFLO Scrolling

  10
• Audio Booster

  10
• Bluetooth FTP Profile/Explorer

  10
• Bluetooth BPP

  10
• Bluetooth SAP

  10
• Network Plug-in for file explore

  10
• FM Radio application

  10
• YouTub client

  10
• Streaming Video Player

  10
• Opera Browser

  10
• Large start menu

  10
• Long press end key

  10
• Startup animation engine

  10
• Manila

  10
• HTC Gizmo

  10
• Album

  10
• Music

  10
• RSS Hub

  10
• Voice speed dial

  10
• Flash lite 2.1 player

  10
• Flash lite 2.1 plug-in

  10
• Carrier Specific Applications

  10
• Abaxia Home Screen (Orange)

  10
• Mobile TV (Vodafone)

  10
• Pocket Video Player (Orange)

  10
• WorldCard Mobile

  10
• Network Address Book (SynML)(O2DE)

  10
• Visto Small Icon(Stub client) (Vodafone)

  10
• Voice commander (HTC Asia)

  10
• Talking dictionary(HTC Asia)

  11
• Antivirus (Vodafone)

  11
• RIM Blackberry Push E-mail Client (Vodafone)

  11
• WAP Push OTA (Vodafone)

  11
• GPS Navigation SW Copilot

  11
• GPS Navigation SW TomTom

  11
• GPS Navigation SW Telmap(Vodafone)

  11
• GPS Navigation SW Mappy(Vodafone)

  11
• GPS Navigation SW Webrasca(Vodafone)

  11
• Regulatory

  11
• GCF certification [Operator dependent]

  11
• R&TTE: EMC / EMI, Safety SAR [European Union]

  11
• WiFi Certification [manufacture option]

  11
• BQB (Bluetooth Qualification Body) certification

  11
• Windows Mobile Logo (NTSL)

  11
• USB certification

  11
• CB certificate / report [International]

  11
• UAELAB [UAE]

  11
• ICASA [T.B.D.] [South Africa]

  11
  • 1.2 Product overview

    12
• 2. Device Disassembling and Assembling Procedure

  18
  • 2.1 Tools List

    18
• level

  18
• No.

  18
• Item

  18
• Vendor

  18
• P/N

  18
• L 1

  18
• Mini USB DATA interface Cable

  18
• Earphone Headset

  18
• AC Adapter

  18
• WLAN AP

  18
• Mini Memory Card with Diag. test program (need be encoded by HTC)

  18
• HTC design

  18
• mini SD memory card for ROM code re-flash ( must be encoded by HTC)

  18
• HTC design

  18
• Y cable for ROM code re-flash and diagnostic test program

  18
• HTC special tools

  18
• RTT-00004

  18
• USB SD card reader

  18
• (ZENITRON WFGMRSD-TP)

  18
• RTT-00005

  18
• Diagnostic card for Diamond

  18
• DCT-00001

  18
• Unit current consumption test fixture

  18
• HTC design

  18
• Power supply

  18
• Current Meter

  18
• Mobile tester

  18
• L 2

  18
• Special Made Plastic Stick

  18
• HTC special tools

  18
• Hand tools

  18
• Navi Board to M/B assembly fixture

  18
• HTC design

  18
• RTT-00001

  18
• LCD FPC to M/B assembly fixture

  18
• HTC design

  18
• RTT-00003

  18
• Mylar for Navi keycap gap control(30x5xT0.15)

  18
• RTT-00011

  18
• Mylar for Navi keycap gap control(30x10xT0.15)

  18
• RTT-00012

  18
• Label printer

  18
• L 2.5

  18
• Lead-free Soldering station

  18
• Air heater

  18
  • 2.2 Disassembling procedure

    19
• Tools needed for Assembling and Disassembling process.

  19
• 1. Lens Cleaning Cloth.

  19
• 2. Philips Screw Driver 000X40.

  19
• 3. Flat Plastic Stick.

  19
• 4. Plastic Tweezers.

  19
• 5. Board to board connector

  19
• assembly fxture

  19
• Hold the thumbs on the top left and bottom right of the battery cover and slide it upwards and remove the battery cover

  19
• Slide down the stylus

  19
• Remove the battery

  20
• Unfasten the 3 screws at the location indicated and remove the antenna cover carefully

  20
• Unfasten the 3 screws at the location indicated and remove the sim cover carefully

  20
• Remove the cap from the antenna cover

  21
• Remove the speaker

  21
• Caution: Avoid damage the speaker

  21
• Unfasten the 2 screws at the location indicated and remove the stylus supporter

  21
• Remove the metal cover

  22
• Release the hook of cable cover from the housing then separate thr GPS coxial cable from the cover then remove the coaxial cble cover carefully

  22
• Remove the volume button cover

  22
• Remove the power button cover

  23
• Remove the lcm fpc tape from the connector

  23
• loose the lcm fpc cable from the connector

  23
• Disconnect the FPC cable by using twezeers carefully

  24
• Disconnect the lcm and navi board connector from the main board

  24
• release the hook and turn over the main board

  24
• Disconnect the gps coaxial cable from the main board carefully

  25
• Note: Do not re-use the BT/Wifi and GPS coaxial cable when you disassemble the coaxial cable. Need to change the new coaxial cable

  25
• Separate the sim fpc board from the main board then turn it over

  25
• remove the tape from the connector

  25
• remove the sim fpc from the main board carefully

  26
• loose the power button cable from thr housing carefully

  26
• loose the volume button cable from the housing carefully

  26
• Remove the gasket tape

  27
• Disconnect the bt/wifi coaxial cable from the navi board

  27
• Use flat plaastic stick to slip out then take out the rigid flex board from the housing carefully

  27
• Disconnect the GPS coaxial cable from the rigid flex board carefully

  28
• Disconnect the BT/Wifi coaxial cabel from the rigid flex board carefully

  28
• Remove the tape from the connector

  28
• loose the 2nd camera connector then remove the 2nd camera module from the connector carefully

  29
• Remove the main camera module from the housing carefully

  29
• Remove the 4 screws from the housing

  29
• remove the microphone rubber from the navi board

  30
• Before disassemble the Navi module push the FPC cable to upeer direction

  30
• Press the Navi board lightly to push down for disassembly

  30
• remove the receiver from the housing carefully

  31
• Disassembly completed!

  31
• Note: Due to the S/N label hinds the backward of bezel and you cant see the serial number. Its no need to fill in the serail number when replacing the defective T/P+LCD module

  31
  • 2.3 Assembling procedure

    32
• Tools needed for Assembling and Disassembling process.

  32
• 1. Lens Cleaning Cloth.

  32
• 2. Philips Screw Driver 000X40.

  32
• 3. Flat Plastic Stick.

  32
• 4. Plastic Tweezers.

  32
• 5. Board to board connector

  32
• assembly fxture

  32
• Insert the navi board module into the housing

  32
• fasten the 4 screws as indicated position of picture

  32
• Torque: 0.5 0.1kgf-cm

  32
• P/N: 72H02456-00M * 4

  32
• attach the microphone rubber on the indicated position of navi board

  33
• atttach the receiver into the housing carefully

  33
• Assemble the main camera odule into the rigid flex board

  33
• assemble the 2nd camera module into the rigid flex board

  34
• Stick the tape on the connector

  34
• install the wifi/bt coaxial cable into the rigid flex board

  35
• install the GPS coaxial cable into the rigid flex board

  35
• Rip the tape of main camera and rigid flex board then assemble the rigid flex board on the frame

  35
• rip the tape of power and volume switch then stick on the frame of the housing

  36
• push the bt/wifi coaxial cable into the fillister of the front bezel

  36
• insert the wifi/bt coaxial cable into the connector of navi board

  36
• stick the gasket tape on the front bezel

  37
• Connect the SIM FPC board into the main board then stick the tape on the connector

  37
• Put down the SIM FPC board by aligning the 2 holes onto the main board

  38
• Connect the GPS coaxial cable into the main board then put the main board on the housing

  38
• Note: make sure to insert the main board and lock with the hook

  38
• Assemble the navi board and lcm fpc connectors by using assembly fixture

  39
• Attach the rigid flex board FPC cable into the main board then stick the tape on the connector

  39
• Attach the volume button into the housing

  40
• Attach the GPS coaxial cable into the support cover and hook the cover into the housing

  40
• Attach the power button into the housing

  40
• Place the metal cover on the bacward of the front cover

  41
• Attach the stylus suppoter onto the front bezel and faten the 2 screws

  41
• Torque: 0.5 0.1kgf-cm

  41
• P/N: 72H02454-00M * 2

  41
• Attach the magnet into the slot of the stylus supporter

  42
• Attach the speaker into the antenna cover assembly

  42
• Attach the cap into the antenna cover assembly

  42
• Attach the antenna cover onto the front bezel

  43
• Fasten the 3 screws into the antenna cover

  43
• Torque: 0.9 0.1kgf-cm

  43
• P/N: 72H02474-00M * 1

  43
• P/N: 72H02767-00M *2

  43
• (Silver scrtws)

  43
• Attach the 5 screws into the SIM cover

  44
• Torque: 0.5 0.1kgf-cm

  44
• P/N: 72H02668-00M * 2

  44
• P/N: 72H02474-00M * 3

  44
• Insert the battery into the unit

  44
• Insert the battery cover

  45
• Insert the stylus

  45
• Assembly completed!

  45
• 3. ROM Re-flash Procedure

  46
  • 3.1 ROM upgrade thru RUU (Re-flash Upgrade Utility)

    46
• Connect device to PC

  46
• 1. Setting and allow USB connections in

  46
• Microsoft ActiveSync.

  46
• 2. Connect your device and desktop/ or

  46
• laptop via USB cable.

  46
• 3. Check the pop-up message from

  46
• Microsoft ActiveSync when device is

  46
• synchronized with PC.

  46
• Download OS Image from SDO

  46
• 4. Download OS image from SDO. http://htcscm10.htc.com.tw/SDO

  46
• 5. Un-zip the file and execute RUU program.

  46
• Check the setting of menu

  46
• 6. Select the type of USB connection with

  46
• ActiveSync mode in the settings of

  46
• menu.

  46
• RUU-1

  47
• 7. Hold the volume down key then

  47
• press power button to trigger the

  47
• boot loader mode.

  47
• 8. Read the pop-up message form

  47
• ROM update utility and select the I

  47
• understand checkbox.

  47
• 9. Click Next to proceed.

  47
• RUU-2

  47
• 10. Read the pop-up message form ROM update utility to follow and perform the instructions and select the I completed checkbox.

  47
• 11. Click Next to proceed.

  47
• RUU 3

  47
• 12. Current image version

  47
• confirmation.

  47
• 13. Click Update to proceed

  47
• RUU-4

  48
• 14. Double verify the ROM revision which you want to update before re-flash procedure.

  48
• 15. Click Next to proceed.

  48
• RUU-5

  48
• 16. Read the information from pop-up message and the OS update procedure will takes 10 minutes long.

  48
• 17. Click Next to proceed.

  48
• RUU 6

  48
• 18. You can see the update progress from your PC and in your device.

  48
• RUU 7

  48
• 19. The OS upgrade is finished, click Finish to close the utility.

  48
  • 3.2 Rom Image upgrade thru SD card

    49
• Download OS Image from SDO

  49
• 1. Download OS image from

  49
• SDO.

  49
• http://htcscm10.htc.com.tw/SDO

  49
• 2. Un-zip the image file.

  49
• Format SD card and copy image file to SD card

  49
• 3. Select file system and format the SD card to FAT32 mode.

  49
• 4. Copy image file XXX.nbh to the

  49
• micro SD card and rename to

  49
• DIAMIMG.NBH.

  49
• SD Upgrade - 1

  50
• Note: The display with line of diagnostic mode is normal due to it is reliability issue for VGA resolution.

  50
• 5. Connect the USB Y cable into the unit.

  50
• 6. Connect the card reader and AC adapter into the USB Y cable.

  50
• SD Upgrade - 2

  50
• 7. Turn the device power off and insert Diagnostic SD card.

  50
• 8. Press and hold Volume down+ Right button, and press Power button to entry Boot loader mode.

  50
• 9. Press Power button to start upgrade procedure.

  50
• SD Upgrade - 3

  50
• 10. Reading source code from SD card.

  50
• [Note]: This process will takes 10 minutes, please dont power off the device.

  50
• SD Upgrade - 4

  51
• 11. After finish, press Reset

  51
• button to reboot.

  51
• 4. DIAGNOSTIC PROGRAM

  52
  • 4.1 List of Diagnostic / WinCE Test Items

    52
• Mode

  52
• No

  52
• Item

  52
• Description

  52
• Remark

  52
• Diagnostic

  52
• Function Test

  52
• Auto

  52
• Auto Regular Tests (Display, B.L, Vibrator, etc)

  52
• ROM Checksum Test

  52
• ROM size

  52
• Stylus Detect Test

  52
• Stylus remove and insert

  52
• LED Test

  52
• Backlight of Navi board module

  52
• Display Test

  52
• Color bar/R/G/B/Black/White/Gray pattern.

  52
• LCD Back Light Test

  52
• LCD back light test (On/Dim/Off).

  52
• Vibrator Test

  52
• Vibrator on test.

  52
• Key Test

  52
• Power, Volume up, Volume down, Key action, Key left, Key up, Key right, Key down

  52
• G Sensor Test

  52
• Motion G sensor function test

  52
• Run-in Test

  52
• 1 Hour

  52
• 1 Hour Run-in Test/Press Soft1 key.

  52
• Option

  52
• 2 Hours

  52
• 2 Hours Run-in Test/Press Soft 2 key.

  52
• Option

  52
• 4 Hours

  52
• 4 Hours Run-in Test/Press Start key.

  52
• Option

  52
• 8 Hours

  52
• 8 Hours Run-in Test/Press OK key.

  52
• Option

  52
• Format Internal Storage (Personal information, talk times)

  52
• Device Info

  52
• Win CE

  52
• Bluetooth Test

  52
• Bluetooth Function Test

  52
• USB Test

  52
• USB link test (Microsoft ActiveSync)

  52
• Camera Test

  52
• Camera Function Test

  52
• WLAN Test

  52
• WLAN Function Test

  52
• GPS Test

  52
• GPS Function Test

  52
• FM Radio

  52
• FM Radio Function Test

  52
• Audio Test

  52
• All Audio Function Test

  52
• Cap Sensor Test

  52
• Navi Cap Sensor Function Test

  52
• Unit Repair Process

  53
• Pre-load Process-1

  54
• 1. Download diagnostic program from SDO (DOC-00040662).

  54
• http://htcscm10.htc.com.tw/SDO

  54
• Pre-load Process-2

  54
• Note: The display with line of diagnostic mode is normal due to it is reliability issue for VGA resolution.

  54
• 2. Copy the diagnostic and ROM code into the source mater card

  54
• 3. Connect the USB Y cable into the unit.

  54
• 4. Connect the card reader and AC adapter into the USB Y cable.

  54
• Pre-load Process-3

  54
• 5. Turn the device power off and insert Diagnostic SD card into the USB card reader.

  54
• 6. Press and hold Volume down + Right button and press Power button then enter Diagnostic mode.

  54
• 7. Press Action key to enter Diagnostic mode.

  54
• Pre-load Process-4

  55
• 8. Press action key to select Content Tool for content files restore.

  55
• Pre-load Process-5

  55
• 9. Press action key to select Check Contents before doing the file pre-load.

  55
• Pre-load Process-6

  55
• 10. Confirm the checking result and shows on the screen.

  55
• Pre-load Process-7

  56
• 11. Press action key to select Restore Content to MoviNAND

  56
• Pre-load Process-8

  56
• 12. It will restore content files into internal storage automatically.

  56
• Pre-load Process-9

  56
• 13. It shows the checksum and total time after finishing the content files restore.

  56
• Pre-load Process-10

  57
• 14. Reboot the device then enter OS to check the content files in the internal storage.

  57
• Pre-load Table

  57
• Pre-load the all files into the internal storage.

  57
• WinCE Test

  58
• Bluetooth Test - 1

  58
• 1. Tap icon Comm Manager on the Today screen and turn on Bluetooth.

  58
• 2. Tap the icon Settings down-right the corner of the screen and select the Make this device. Checkbox.

  58
• 3. Press Action key (Jog-ball) to go next test pattern.

  58
• Bluetooth Test-2

  58
• 4. Tap Start->Settings->Connections-> Beam and select Receive all. Checkbox.

  58
• 5. To create a file, tap Start->Programs ->Notes->New

  58
• 6. Tap and select the Beam file

  58
• Bluetooth Test-3

  58
• 7. Once device is searched, tap the device to send the file.

  58
• 8. Return to Today screen and tap Start->Program->Comm Manager ->Bluetooth to turn off Bluetooth.

  58
• USB Test

  59
• 1. Start up the Microsoft( ActiveSync(program in the PC.

  59
• 2. Select ActiveSync in the setting of menu

  59
• 3. Insert USB cable and connect unit to desktop/ or laptop.

  59
• 4. The USB to PC icon -> is appears on the Today screen when your device is connected to your desktop/ or laptop.

  59
• Camera Test

  59
• 1. Tap Start->Program->Camera or Press Camera button to turn on the Camera.

  59
• 2. Make sure the device will present and enter the preview display.

  59
• 3. Check camera pre-view and image quality.

  59
• WLAN Test

  60
• 1. Tap icon Comm Manager on the Today screen and turn on WLAN.

  60
• 2. Select the hot-spot/ or access point which searchable and appears on screen.

  60
• 3. Once the hot-spot (access point) is connected, press the IE button and logon Internet.

  60
• GPS Test

  60
• 15. Download test program from SDO (DOC-00042190)

  60
• http://htcscm10.htc.com.tw/SDO

  60
• 16. Setup the COM port to COM4.

  60
• 17. Place device in GPS receptor coverage area and tap the icon Open GPS.

  60
• 18. Check the GPS status as picture shown.

  60
• FM Radio Test

  60
• 1. Insert the headset into the USB

  61
• connector before doing the testing.

  61
• 2. Tap icon FM Radio in the programs of the menu.

  61
• 3. Select the different channels for testing.

  61
• Audio Test-1

  61
• 1. Download test program from SDO (GSD-00004973)

  61
• http://htcscm10.htc.com.tw/SDO

  61
• 2. Un-zip the image file.

  61
• 3. Copy mfgtest.dll and Audio Test.exe to internal storage.

  61
• 4. Execute Audio Test program from internal storage.

  61
• 5. Choose the each test in the menu of Tools

  61
• Audio Test-2

  61
• 6. Select the Speaker Test then press Play button for testing

  61
• Audio Test-3

  61
• 7. Select the Speaker Test then press Play button for testing

  62
• Audio Test-4

  62
• 8. Connect the headset into the USB port before doing the testing

  62
• 9. Select the Headset Test then press Play button for testing

  62
• Audio Test-5

  62
• 10. Select the Int-Rec Test then press the Record button for voice recording first

  62
• 11. Stop the voice record then press Play button for internal receiver test

  62
• Audio Test-6

  63
• 12. Connect the headset into the USB port before doing the testing

  63
• 13. Select the Ext-Rec Test then press the Record button for voice recording first

  63
• Cap Sensor Test-1

  63
• 1. Install CapSensorTest tool to device.

  63
• 2. Execute the test tool.

  63
• Cap Sensor Test-2

  63
• 3. Light touch the surface of keycap and press down the Navi key.

  63
• 4. The program will exist automatically once the function is normal.

  63
• Cap Sensor Test-3

  63
• 5. Find the CapSensorTestOK log file in the folder and it means cap sensor function pass.

  64
• Test Procedure

  65
• How to select test item: Using navigation button -"Up" or "Down" to select the test items

  65
• How to execute the test program: Press Action button to start each of test items.

  65
• Diagnostic

  65
• Main Menu/Function Test Menu

  65
• 1. Turn the device power off and insert Diagnostic SD card into the USB card reader.

  65
• 2. Press and hold Volume down + Right button and press Power button then enter Diagnostic mode.

  65
• 3. Using to select the test item and move to next page as well.

  65
• 4. Select item Function Test to find

  65
• the Function test menu.

  65
• Auto Test

  65
• 5. Press the Action key to start the Auto-test.

  65
• 6. It will perform the regular tests, please follow the system instruction to do the test.

  65
• ROM Checksum Test

  66
• 7. Press Action key to select

  66
• 8. The Rom Checksum will be

  66
• displayed on the screen

  66
• Stylus Detect Test

  66
• 9. Press Action key to select

  66
• 10. It will perform the stylus test, please follow the system instruction to remove and insert the stylus.

  66
• LED Test

  66
• 11. Press Action key to select

  66
• 12. It will perform the LED test, please follow the system instruction to remove and insert the stylus.

  66
• Display Test (and RED/ GREEN pattern)

  67
• 13. Press Action key to select Display Test on Function test menu.

  67
• 14. After the test pattern is show up, please check the pattern if any un-uniform color or chromatist.

  67
• 15. Press Action key to continue the next test pattern.

  67
• Display Test (BLUE/ BLACK pattern)

  67
• 16. Press Action key to continue the next test pattern.

  67
• Display Test (WHITE/Color bar pattern)

  67
• 17. Press Action key to continue the next test pattern.

  67
• LCD Back Light Test

  68
• 18. Press Action key to select B.L Test on Function test menu.

  68
• 19. Press Action key to switch the LCD backlight level from Level 1,Level2, Level3, Level4, Level5 Press Action key to exit and return to Function test menu.

  68
• Vibrator Test

  68
• 20. Press Action key to select Vibrator Test on Function test menu.

  68
• 21. Press Action key to exit and return to Function test menu.

  68
• Key Test

  68
• 22. Press Action key to select Button Test on Function test menu.

  68
• 23. Follow the instruction on screen to perform the Key/Button test

  68
• (Power, Volume up, Volume down, Key action, Key left, Key up, Key right, Key down).

  68
• The screen will return to Function test menu after the test is finished.

  68
• G Sensor Test

  69
• 24. Press Action key to select G Sensor Test on Function test menu.

  69
• 25. Put the unit on the table with when performing this G sensor testing.

  69
• 5. Power Measurement Test

  70
  • 5.1 Main board leakage current Test Procedure

    70
• This is a quick method to measure if any abnormal leakage current on main board which caused high power consumption compare to GOOD main board.

  70
• (1) Requirement

  70
• - Control box

  70
• Equipment list

  70
• 1. Control box

  70
• 2. 4 colors cable

  70
• Cable A: Red

  70
• Cable B: Yellow

  70
• Cable C: Green

  70
• Cable D: Black

  70
• C. types Jig

  71
• Jig - E (3 pins-Short)

  71
• Equipment set up

  71
• 1. Connect control box and jig through

  71
• 3 colors cable with red, black and yellow

  71
• 2. Set up each button by row A~D according to product specification

  72
• Following is an setting for Diamond

  72
• MODEL

  72
• JIG TYPE

  72
• Button set up matrix

  72
• A

  72
• B

  72
• C

  72
• D

  72
• Diamond

  72
• E

  72
• X

  72
• It means, press button A0,B8,D0

  72
• 3. Install jig to device

  72
• (the photo is for reference only)

  72
• Start testing

  72
• 1. Turn on control box power button

  72
• 2. Press Power button to turn on the Device

  73
• 3. In main page, Check phone status, Click Turn on flight mode

  73
• Set the unit to :

  73
• * Flight mode

  73
• * Make sure all RF function is off (phone, BT, Wifi..)

  73
• Idle current test

  73
• 4. Measure Idle mode current. Idle current value must under 80mA, if over the criteria, it means M/B failed, please replace M/B for repair.

  73
• Sleep current test

  73
• 5. After idle current checked, Switch OFF the unit. Unit is turn off and no display. sleep current value must under 3mA, if over the criteria, it means M/B failed, please replace M/B for repair.

  73
• Conclusion:

  73
• If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD. If there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace M/B for repair.

  73
  • 5.2 Battery rundown test procedure

    74
• Test Requirement:

  74
• -Windows 2000/XP

  74
• -USB Cable

  74
• -ActiveSync 4.2 above (WINCE 6.0 should use ActiveSync 4.5)

  74
• -Master Unit

  74
• -Battery in Warranty

  74
• Caution: Please charge your unit to full capacity for battery (until the green light is displayed) before doing the test.

  74
• TEST PROCEDURE

  74
• Connect device to PC

  74
• I. Setting and allow USB connections in Microsoft ActiveSync.

  74
• II. Connect your device and desktop/ or laptop via USB cable.

  74
• III. Check the pop-up message from Microsoft ActiveSync when device is synchronized with PC.

  74
• Copy the Battery Rundown tool into the device

  74
• IV. Make a folder in the device.

  74
• V. Copy PowerDetect.exe into the folder.

  74
• Battery Rundown-1

  75
• VI. Adjust the Backlight brightness into the maximum level on battery power.

  75
• Battery Rundown-2

  75
• VII. Disable Turn off backlight if device is not used for in Battery power.

  75
• Battery Rundown-3

  76
• VIII. Execute PowerDetect.exe under WinCE

  76
• Battery Rundown-3

  76
• IX. Set the Sleep as 1hour

  76
• X. Set the Record as 2Mins

  76
• Battery Rundown-4

  77
• XI. After running 1 hour, the test will be finished.

  77
• XII. Press the Power Button to turn on the power.

  77
• XIII. Click ok to quit the program.

  77
• Battery Rundown-5

  77
• XIV. Test result is generated into the log file as PowerCap(x).

  77
• Battery Rundown-6

  78
• XV. Tag the log file to check the capacity.

  78
• Caution: If the capacity is under 70%,

  78
• Please replace a new battery.

  78
• 6. Cosmetic Inspection Criteria

  79
  • 6.1 Classes definition of inspective area

    79
• Class A area => The front side of main unit involve all buttons and LED lens except LCD.

  79
• Class C area => 4 sides and back views of main unit.

  79
• Class D area => The socket of battery, inner side of battery cover.

  79
• Photo of inspection areas

  79
• Diamond #A: Diamond #B:

  79
• Diamond #A: Diamond #B:

  79
• Diamond #A:

  79
• Diamond #B:

  79
• Class A area

  79
• Class C area

  79
• Class D area

  79
• IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA RESPECTIVELY.

  79
• Description

  79
• D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot

  79
• Inspecting distance: 30 5cm / Mechanical inspection angle: 90 degrees /

  79
• LCM inspection angle: 90 15 degrees / Inspection time: 5 seconds per surface.

  79
• Ambient illumination is to be 500-1100 Lux

  79
• The inspection condition of Newton ring:

  79
• a. Inspection distance: 30cm / Inspection time: 5 sec

  80
• b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)

  80
• c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp.

  80
• d. The criteria of Newton ring's tinges and measure of area must follow up the worst-case sample.

  80
  • 6.2 Display inspection

    80
    • Inspection Defects

      80
• Accept Level

  80
• Level

  80
• Electrical Characteristic Defects

  80
• Bright Dots

  80
• Single

  80
• Red+ Green+ Blue 3, S > 5mm.

  80
• Minor

  80
• 2 adjacent

  80
• Minor

  80
• 3 or more adjacent

  80
• Minor

  80
• Dark Dots

  80
• Single

  80
• Total Number 2, S > 5mm.

  80
• Minor

  80
• 2 adjacent

  80
• Minor

  80
• Dark or Bright lines

  80
• Minor

  80
• All Allowable Dots Defects

  80
• Total Number 3, S > 5mm.

  80
• Minor

  80
• Shift and tilt of screen viewed area

  80
• The black edge around display area must be detected by front view.

  80
• Minor

  80
• Foreign Scratch, Objects or Lint

  80
• on power off

  80
• status

  80
• Scratch

  80
• 0.03 < W 0.1 (mm)

  80
• L 5 (mm), N 2 (mm)

  80
• Minor

  80
• Lint (linear foreign objects)

  80
• 0.03 < W 0.1 (mm)

  80
• 0.3 < L 3.0 (mm)

  80
• N 5

  80
• Minor

  80
• Spots

  80
• 0.1 < D 0.3 (mm), N 4

  80
• Minor

  80
  • Fish eye on film

    80
• 0.1 < D 0.4 (mm), N 4

  80
• Minor

  80
• Breakage on film surface

  80
• Not acceptable

  80
• Minor

  80
• Total acceptable defect quantity 10

  80
• Minor

  80
  • 6.3 Main unit inspection

    81
• Gap & Step inspection

  81
• Description

  81
• Accept criteria

  81
• Level

  81
• GAP BETWEEN ALL GENERIC ME PARTS

  81
• < 0.4 mm

  81
• Minor

  81
• GAP BETWEEN TOUCH WINDOW AND A PARTS

  81
• < 0.3 mm

  81
• Minor

  81
• STEP BETWEEN MATING PARTS

  81
• < 0.3 mm

  81
• Minor

  81
• It is generic cosmetic inspection criteria for all products if there have any conflict with these generic criterions; please follow the product inspection criteria respectively.

  81
• 7. Generic Troubleshooting

  82
• 1Main Unit Does Not Respond to Power Button

  82
• (1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging.

  82
• (2) Check if battery installed well.

  82
• (3) Check the Power Button whether its damaged.

  82
• (4) Replace another battery pack.

  82
• (5) Try to start boot-loader mode [refer to section 4.2]. Re-flash ROM if boot loader mode is enabled.

  82
• (6) Check all connectors including LCD FPC to Main Board.

  82
• (7) Replace Main Board if necessary.

  82
• (8) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  82
• 2Touch Panel Does Not Respond to Screen Tap

  82
• (1) Check the connection of LCM FPC cable whether is properly connected.

  82
• (2) Try to cold boot the unit then perform screen tap again.

  82
• (3) Try with another T/P with housing assembly.

  82
• (4) Try with another Main Board.

  82
• (5) Replace T/P with housing if necessary

  82
• (6) Replace Main Board if necessary.

  82
• (7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  82
• 3Buttons Do Not Respond

  82
• (1) Try to cold boot the unit then tries again.

  82
• (2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not responding.

  82
• (3) Try with another Main Board or Front Bezel.

  82
• (4) Replace Main Board or Front Bezel if necessary.

  82
• (5) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  82
• 4Unusual Vertical / Horizontal lines or partial display

  83
• (1) Check the connection of LCM FPC whether is properly connected.

  83
• (2) Try to cold boot the unit then tries again.

  83
• (3) Try to re-flash the ROM code.

  83
• (4) Try with another T/P with housing assembly.

  83
• (5) Try with another Main Board.

  83
• (6) Replace T/P with housing assembly if necessary

  83
• (7) Replace Main Board if necessary.

  83
• (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  83
• 5Back Light Does Not Turn ON/OFF

  83
• (1) Check the connection of LCM FPC whether is properly connected.

  83
• (2) Try to re-flash the ROM code.

  83
• (3) Try with another T/P with housing assembly.

  83
• (4) Try with another Main Board.

  83
• (5) Replace T/P with housing assembly if necessary

  83
• (6) Replace Main Board if necessary.

  83
• (7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  83
• 6PC Connection not possible

  83
• (1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is installed.

  83
• (2) Check whether Connection Settings in the MS ActiveSync is properly set.

  83
• (3) Check whether it connects with other cables or cradle, customers cable might be damaged.

  83
• (4) Check the external appearance of the connector on the unit whether it is physically damaged.

  83
• (5) Try to re-flash the ROM code.

  83
• (6) Replace Main Board if necessary.

  83
• (7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  83
• 7Battery Pack does not start

  84
• (1) Make sure the battery cover is closed properly.

  84
• (2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition.

  84
• (3) Check whether AC Adapter is functioning properly.

  84
• (4) Check whether the condition of Battery Charging status is correct.

  84
• (5) Check the appearance of Battery Pack if any abnormal..

  84
• (6) Try with another Battery Pack or Replace Battery Pack if necessary

  84
• (7) Try with another Main Board or Replace Main Board if necessary.

  84
• (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  84
• 8Battery discharges quickly even after fully charged

  84
• (1) Make sure the Battery Pack takes fully charge with AC Adapter.

  84
• (2) Check whether the condition of Battery Charging status is correct.

  84
• (3) Dismantle the unit and check the appearance of Battery Pack.

  84
• (4) Try with another Battery Pack or Replace Battery Pack if necessary

  84
• (5) Try with another Main Board or Replace Main Board if necessary.

  84
• (6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  84
• 9Battery Pack does not recharge

  84
• (1) Make sure the Battery Pack takes fully charge with AC Adapter.

  84
• (2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4 hours.

  84
• (3) Dismantle the unit and check the appearance of Battery Pack.

  84
• (4) Try with another Battery Pack or Replace Battery Pack if necessary

  84
• (5) Try with another Main Board or Replace Main Board if necessary.

  84
• (6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  84
• 10No Sound from Speaker or Distorted sound

  84
• (1) Check Sound & Notifications Settings in the unit for Sound Enabling.

  84
• (2) Make sure its not MUTED.

  84
• (3) Try to re-flash the ROM code.

  85
• (4) Clean up the speaker connection side on MB if there is any contamination.

  85
• (5) Dismantle and Check whether the Speaker is properly installed (Orientation)

  85
• (6) Replace Speaker if necessary.

  85
• (7) Replace Main Board if necessary.

  85
• (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.

  85
• 11No Recorded Sound or Distorted sound

  85
• (1) Check Sound & Notifications Settings in the unit for Sound Enabling.

  85
• (2) Make sure its not MUTED.

  85
• (3) Try to re-flash the ROM code.

  85
• (4) Dismantle and Check whether the Microphone is properly installed.

  85
• (5) Replace Microphone if necessary.

  85
• (6) Replace Main Board if necessary.

  85
• (7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  85
• 12Wireless connection (WLAN/BT) not functioning

  85
• (1) Make sure the wireless environment is OK before connecting to WLAN.

  85
• (2) Make sure the wireless connection setting has properly set.

  85
• (3) Make a life connection with Internet or another device.

  85
• (4) Try to re-flash the ROM code.

  85
• (5) Try with another main board if necessary

  85
• (6) Try with another Navi board assembly module if necessary

  85
• (7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  85
• 12GPS not functioning

  85
• (1) Make sure the GPS environment is outside of room before connecting to satellite.

  85
• (2) Make sure the GPS connection setting has properly set in navigation map.

  85
• (3) Try to re-flash the ROM code.

  85
• (4) Try with another main board if necessary

  85
• (5) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  86
• 12Internal storage device not functioning

  86
• (1) Make sure the GPS environment is outside of room before connecting to satellite.

  86
• (2) Make sure the GPS connection setting has properly set in navigation map.

  86
• (3) Try to re-flash the ROM code.

  86
• (4) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.

  86
• 8. Generic Labeling Plan

  87
• Model ID

  87
• DIAM100

  87
• DIAM110

  87
• DIAM120

  87
• DIAM130

  87
• DIAM140

  87
• DIAM300

  87
• Band

  87
• UMTS: 900/2100GSM: 900/1800/1900

  87
• UMTS: 850/1900GSM: 850/1800/1900

  87
• de-3G

  87
• GSM: 900/1800/1900

  87
• UMTS: 850/2100GSM: 900/1800/1900

  87
• de-3GGSM: 900/1800/1900

  87
• UMTS: 900/2100GSM: 900/1800/1900

  87
• ID difference

  87
• Diamond AMetal-Bezel

  87
• Diamond AMetal-Bezel

  87
• Diamond Ano 2nd camera hole

  87
• Diamond BMetal-Bezel(Flat)

  87
• Agency label_DIAM100

  87
• The brand name is shown on Bezel.

  87
• HTC P/N: 77H00598-00M

  87
• Size: 40.3 X 38.55mm

  87
• HTC P/N

  87
• Description

  87
• Agency label_DIAM110

  88
• The brand name is shown on Bezel.

  88
• HTC P/N: 77H00598-01M

  88
• Size: 40.3 X 38.55mm

  88
• HTC P/N

  88
• Description

  88
• Agency label_DIAM120

  89
• The brand name is shown on Bezel.

  89
• HTC P/N: 77H00598-03M

  89
• Size: 40.3 X 38.55mm

  89
• HTC P/N

  89
• Description

  89
• Agency label_DIAM130

  90
• The brand name is shown on Bezel.

  90
• HTC P/N: 77H00598-05M

  90
• Size: 40.3 X 38.55mm

  90
• HTC P/N

  90
• Description

  90
• Agency label_DIAM140

  91
• The brand name is shown on Bezel.

  91
• HTC P/N: 77H00598-06M

  91
• Size: 40.3 X 38.55mm

  91
• HTC P/N

  91
• Description

  91
• Agency label_DIAM300

  92
• The brand name is shown on Bezel.

  92
• HTC P/N: 77H00598-02M

  92
• Size: 40.3 X 38.55mm

  92
• HTC P/N

  92
• Description

  92
• Unit label location explanation

  93
• Water sensitive label

  93
• HTC P/N: 77H00668-00M

  93
• Qty: 1

  93
• Tamper evident label

  93
• HTC P/N: 77H00460-01M

  93
• Qty: 2

  93
• Battery label

  94
• Standard battery 900mAh_Li-ion_English version

  94
• HTC P/N: 35H00112-00M (TWS)

  94
• 35H00112-01P (Samsung)

  94
• Standard battery 900mAh_Li-ion Polymer (Desay) _English version

  95
• HTC P/N: 35H00113-00P (Sony, Desay)

  95
• 9. Generic Spare Part List and Photos

  96
  • 9.1 SPL for Repair

    96
• Item

  96
• P/N

  96
• Description

  96
• Qty

  96
• Substitute

  96
• 35H00112-00M

  96
• BATTERY_LI-ION,900mAh,3.7V,TWS,ICP533640SR,MAXELL,60/-20degC,42*40*5.5mm

  96
• 36H00684-00M

  96
• Speaker,KDIC,MPS-101706BA

  96
• 36H00685-00M

  96
• Receiver,KDIC,MPR061501DA

  96
• 51H10073-00M

  96
• Rigid-Flex Board ASSY, Upper BD with ACF Assy, Diamond

  96
• 54H00278-00M

  96
• Camera Module,FF,Largan,Largan,PREMIER,NBR727 Module drawing, mutual tek,0.3Mpixel,5*5*2.62mm,Diamond

  96
• 54H00279-00M

  96
• Camera Module,PREMIER,CMHT-3A403D,AF,TDK,LARGAN,,Micron MI-3130,3.1Mpixel,Micron,19.2*8.9*6.3mm,Raphael

  96
• 71H02327-00M

  96
• Cover, MEGA POWER,COVER LEFT COAXIAL CABLE,DIAMOND

  96
• 71H02328-00M

  96
• Button, UNITEL, PWRBTN, DIAMOND

  96
• 71H02329-00M

  96
• Button, UNITEL, VOLBTN, DIAMOND

  96
• 72H02445-00M

  96
• Magnet, MAGNET DIAMOND

  96
• 72H02453-00M

  96
• Screw,FPHM1.2-1.1(2.6,0.3),Diamond

  96
• 72H02454-00M

  96
• Screw,FPHM1.2-0.25*2.4(2,0.35),AISI-1018,BLACK,Diamond

  96
• 72H02456-00M

  96
• Screw,FPHM1.4-0.3x2.0(2.55,0.2)Ni/BI, Diamond

  96
• 72H02460-00M

  96
• Cover, JUN-YEN, metal cover label, Diamond

  96
• 72H02474-00M

  96
• Screw,M1.4-L4.3-D2.6

  96
• 72H02767-00M

  96
• Screw,M1.4-L4.3-D2.6,Silver,Diamond

  96
• 73H00278-00M

  96
• Cable,MURATA,MXHP34HP0590,PLUG CABLE, coaxial cable, GPS,DIAMOND

  96
• 73H00280-00M

  96
• Cable,MURATA,MXHP34HP0980C1,coaxial cable, BT/WiFi, DIAMOND

  96
• 73H20139-41M

  96
• FPC Pre-Assy, SIM, GLOBAL FLEX, Diamond

  96
• 74H01123-00M

  96
• 74H01131-00M

  96
• Cover Pre-Assy,Antenna,Diamond-A,Diamond

  96
• 74H01132-00M

  96
• Cover Pre-Assy,Battery,Diamond-A,Diamond

  96
• 74H01133-00M

  96
• Cover Pre-Assy,SIM,Diamond-A,Diamond

  96
• 74H01139-00M

  96
• Support Pre-Assy, ASSY Support cover right, RF cable, Diamond

  96
• 74H01144-00M

  96
• 74H01159-00M

  96
• Stylus Pre-Assy,Diamond-A,Diamond

  96
• 76H02515-00M

  96
• Rubber,Silicon,MIC,Diamond

  96
• 76H02650-00M

  96
• Cushion,speaker,27.9*12.75*0.5mm,SCF100,Diamond

  96
• 76H02653-00M

  96
• Tape,BTB connector,16*10*0.06mm,Kapton,Diamond

  96
• 76H02656-00M

  96
• Rubber,BT coaxial plug holder,Diamond

  96
• 76H02692-00M

  96
• Mylar,upper board switch,6.5*4.5*0.05mm,Diamond

  96
• 76H02756-00M

  96
• Mylar,Power key,Diamond

  96
• 77H00460-00M

  96
• Tamper-Evident Label, VOID wording, black background,3*3mm,MING JYE

  96
• 77H00598-00M

  96
• Regulation Label,40.3*38.55mm,CHENG MAY,DIAM300,Diamond

  96
• 77H02203-00M

  96
• Water Sensitive Label,4*2.5mm,Ming Jye, BlueAngels

  96
• 80H00704-00

  96
• FRU-SUB ASSY,TFT-LCD MODULE,TPK,TPK_TW,HITACHI,Black,W/ Bezel,Diamond

  96
• 99HEJXXX-02

  96
• NOTE:

  97
• THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR MORE INFORMATION.

  97
• AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.

  97
• FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO THE REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO IT.

  97
  • 9.2 Board Level 2.5 Repairs

    103
• Basic Repair Instructions for Component Replacement:

  103
• Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

  103
• WarningDO NOT overheat the tape and components to avoid the tape melted and the components damaged

  103
• Step 2 Use Heater Gun (HAKO850B, set the temperature between 350C, Air Speed 3~5) to remove the components.

  103
• Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed

  103
• Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.

  103
• Notice:

  103
• A. Checking the polarity of CON8, and the position can't be shifted.

  103
• B. Checking the polarity of SW8SW7, and it can't be reversed.

  103
• C. All the parts of the PCB should be checked if it is missing or not.

  103
• D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.

  103
• E. When you solder and repair that the soldering iron, temperature must be setup 415. (The temperature range is 4155), and the solder wire's diameter is 0.4/0.5/0.6mm (SAC 305 (1.1%)

  103
• F. Please be noticed to follow below steps for main board repair which is equipped with Golden Capacitor:

  103
• 1. When replacing level 2.5 components located around the golden capacitor:

  103
• I. The temperature of the hot air blower must be under 400c

  103
• II. When apply the hot air to the part / component, the heating time must be under 20 seconds (including the time of removing and soldering)

  103
• III. The temperature of the soldering iron must be under 350c

  103
• IV. When apply the solder tip to the part / component, the heating time must be under 5 seconds

  103
• V. The solder tip must not contact with the golden capacitor

  103
• 2. For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)

  103
• 3. For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor

  103
• Location

  104
• P/N

  104
• Description

  104
• Remark

  104
• MAM1

  104
• 75H00643-00M

  104
• SIM FPC Board

  104
• MAM2

  104
• 75H00772-00M

  104
• Navi Board

  104
• MAM3

  104
• 75H00769-00M

  104
• USB Connector

  104
• MAM7

  104
• 36H00678-00M

  104
• Light Switch

  104
• MAM15

  104
• 75H00768-00M

  104
• LCM FPC

  104
• RGM1

  104
• 75H00750-00M

  104
• GPS Coaxial cable

  104
• RAM1

  104
• 75H00734-00M

  104
• External RF Antenna cable

  104
• Side A Photo and Component Location

  105
• Location

  106
• P/N

  106
• Description

  106
• Remark

  106
• MAM14

  106
• 75H00628-00M

  106
• Upper board FPC

  106
• MAM8

  106
• 75H00771-00M

  106
• USB Connector

  106
• PACON1

  106
• 75H00776-00M

  106
• Battery Connector

  106
• Side B Photo and Component Location

  107
• 10. RF Antenna Specification

  108
• EIRP & Sensitivity Test

  108
• EGSM

  108
• Channel

  108
• EIRP (dBm)

  108
• EIRP Spec

  108
• 28.0

  108
• 28.0

  108
• 28.0

  108
• Cell power (dBm)

  108
• Cell power Spec (dBm)

  108
• DCS

  108
• Channel

  108
• EIRP (dBm)

  108
• EIRP Spec

  108
• Cell power (dBm)

  108
• Cell power Spec (dBm)

  108
• -104.0

  108
• -104.0

  108
• 104.0

  108
• PCS

  108
• Channel

  108
• EIRP (dBm)

  108
• EIRP Spec

  108
• Cell power (dBm)

  108
• Cell power Spec (dBm)

  108
• -104.0

  108
• -104.0

  108
• 104.0

  108
• WCDMA Band VIII

  108
• Channel

  108
• EIRP (dBm)

  108
• EIRP Spec

  108
• Cell power (dBm)

  108
• Cell power Spec (dBm)

  108
• -104.0

  108
• -104.0

  108
• 104.0

  108
• WCDMA Band I

  108
• Channel

  108
• EIRP (dBm)

  108
• EIRP Spec

  108
• Cell power (dBm)

  108
• Cell power Spec (dBm)

  108
• -104.0

  108
• -104.0

  108
• 104.0

  108
• WiFi2400 (b mode)

  109
• WiFi2400 (g mode) (11Mbps)

  109
• EIRP Spec

  109
• >9.0dBm

  109
• >9.0dBm

  109
• EIS Spec

  109
• < -76.0dBm

  109
• < -74.0dBm

  109
  • GPS: @ -128dBm (with Spec: 35)

    109