用户手册 — Intel 200 MHz

目录

• 1.0. MICROPROCESSOR ARCHITECTURE OVERVIEW

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  • 1.1. Pentium® Processor Family Architecture

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  • 1.2. Pentium® Processor with MMX™ Technology

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    • 1.2.1. FULL SUPPORT FOR INTEL MMX™ TECHNOLOGY

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    • 1.2.2. DOUBLE CODE AND DATA CACHES TO 16K EACH

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    • 1.2.3. IMPROVED BRANCH PREDICTION

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    • 1.2.4. ENHANCED PIPELINE

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    • 1.2.5. DEEPER WRITE BUFFERS

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  • 1.3. Mobile Pentium® Processor with MMX™ Technology

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• 2.0. PINOUT

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  • 2.1. Pinout and Pin Descriptions

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    • 2.1.1. PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY PINOUT

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    • 2.1.2. PIN CROSS-REFERENCE TABLE FOR PENTIUM® PROCESSOR WITH MMX™

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  • 2.2. Design Notes

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  • 2.3. Quick Pin Reference

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  • 2.4. Pin Reference Tables

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  • 2.5. Pin Grouping According to Function

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• 3.0. ELECTRICAL SPECIFICATIONS

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  • 3.1. Electrical Characteristics and Differences between the Pentium® Processor with MMX™ Technology and the Pentium Processor 13

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    • 3.1.1. POWER SUPPLIES

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      • 3.1.1.1. Power Supply Sequencing

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    • 3.1.2. CONNECTION SPECIFICATIONS

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      • 3.1.2.1. Power and Ground

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        • 3.1.2.1.1. VCC2 and VCC3 Measurement Specification

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        • 3.1.2.1.2. Decoupling Recommendations

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      • 3.1.2.2. 3.3V Inputs and Outputs

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      • 3.1.2.3. NC/INC and Unused Inputs

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      • 3.1.2.4. Private Bus

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    • 3.1.3. BUFFER MODELS

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  • 3.2. Absolute Maximum Ratings

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  • 3.3. DC Specifications

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  • 3.4. AC Specifications

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• 4.0. MECHANICAL SPECIFICATIONS

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• 5.0. THERMAL SPECIFICATIONS

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  • 5.1. Measuring Thermal Values

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    • 5.1.1. THERMAL EQUATIONS AND DATA

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