Manuels d'utilisation pour Intel 945P

Table des matières

• 1 Introduction

  7
  • 1.1 Terminology

    8
  • 1.2 Reference Documents

    9
• 2 Product Specifications

  11
  • 2.1 Package Description

    11
    • 2.1.1 Non-Grid Array Package Ball Placement

      11
  • 2.2 Package Loading Specifications

    12
  • 2.3 Thermal Specifications

    13
  • 2.4 Thermal Design Power (TDP)

    13
    • 2.4.1 Methodology

      14
      • 2.4.1.1 Pre-Silicon

        14
      • 2.4.1.2 Post-Silicon

        14
    • 2.4.2 Application Power

      14
    • 2.4.3 Specifications

      14
• 3 Thermal Metrology

  15
  • 3.1 Case Temperature Measurements

    15
    • 3.1.1 Thermocouple Attach Methodology

      15
  • 3.2 Airflow Characterization

    16
• 4 Reference Thermal Solution

  19
  • 4.1 Operating Environment

    19
    • 4.1.1 ATX Form Factor Operating Environment

      19
    • 4.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment

      20
  • 4.2 Mechanical Design Envelope

    21
  • 4.3 Thermal Solution Assembly

    21
  • 4.4 Environmental Reliability Requirements

    24