Intel 945P 사용자 매뉴얼

차례

• 1 Introduction

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  • 1.1 Terminology

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  • 1.2 Reference Documents

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• 2 Product Specifications

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  • 2.1 Package Description

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    • 2.1.1 Non-Grid Array Package Ball Placement

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  • 2.2 Package Loading Specifications

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  • 2.3 Thermal Specifications

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  • 2.4 Thermal Design Power (TDP)

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    • 2.4.1 Methodology

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      • 2.4.1.1 Pre-Silicon

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      • 2.4.1.2 Post-Silicon

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    • 2.4.2 Application Power

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    • 2.4.3 Specifications

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• 3 Thermal Metrology

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  • 3.1 Case Temperature Measurements

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    • 3.1.1 Thermocouple Attach Methodology

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  • 3.2 Airflow Characterization

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• 4 Reference Thermal Solution

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  • 4.1 Operating Environment

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    • 4.1.1 ATX Form Factor Operating Environment

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    • 4.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment

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  • 4.2 Mechanical Design Envelope

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  • 4.3 Thermal Solution Assembly

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  • 4.4 Environmental Reliability Requirements

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