Manuels d'utilisation pour Intel Xeon X3440

Table des matières

• Intel® Xeon® Processor 3400 Series and LGA1156 Socket

  1
• 1 Introduction

  7
  • 1.1 References

    7
  • 1.2 Definition of Terms

    8
• 2 Package Mechanical and Storage Specifications

  11
  • 2.1 Package Mechanical Specifications

    11
    • 2.1.1 Package Mechanical Drawing

      12
    • 2.1.2 Processor Component Keep-Out Zones

      12
    • 2.1.3 Package Loading Specifications

      13
    • 2.1.4 Package Handling Guidelines

      13
    • 2.1.5 Package Insertion Specifications

      13
    • 2.1.6 Processor Mass Specification

      13
    • 2.1.7 Processor Materials

      14
    • 2.1.8 Processor Markings

      14
    • 2.1.9 Processor Land Coordinates

      15
  • 2.2 Processor Storage Specifications

    16
• 3 LGA1156 Socket

  17
  • 3.1 Board Layout

    19
  • 3.2 LGA1156 Socket NCTF Solder Joints

    20
  • 3.3 Attachment to Motherboard

    21
  • 3.4 Socket Components

    21
    • 3.4.1 Socket Body Housing

      21
    • 3.4.2 Solder Balls

      22
    • 3.4.3 Contacts

      22
    • 3.4.4 Pick and Place Cover

      22
  • 3.5 Package Installation / Removal

    23
    • 3.5.1 Socket Standoffs and Package Seating Plane

      24
  • 3.6 Durability

    24
  • 3.7 Markings

    25
  • 3.8 Component Insertion Forces

    25
  • 3.9 Socket Size

    25
• 4 Independent Loading Mechanism (ILM)

  27
  • 4.1 Design Concept

    27
    • 4.1.1 ILM Cover Assembly Design Overview

      27
    • 4.1.2 ILM Back Plate Design Overview

      28
    • 4.1.3 Shoulder Screw and Fasteners Design Overview

      29
  • 4.2 Assembly of ILM to a Motherboard

    30
  • 4.3 ILM Interchangeability

    31
  • 4.4 Markings

    32
• 5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

  33
  • 5.1 Component Mass

    33
  • 5.2 Package/Socket Stackup Height

    33
  • 5.3 Socket Maximum Temperature

    33
  • 5.4 Loading Specifications

    34
  • 5.5 Electrical Requirements

    35
  • 5.6 Environmental Requirements

    36
• 6 Thermal Specifications

  37
  • 6.1 Thermal Specifications

    37
    • 6.1.1 Intel® Xeon® Processor 3400 Series (95W) Thermal Profile

      39
    • 6.1.2 Intel® Xeon® Processor 3400 Series (45W) Thermal Profile

      41
    • 6.1.3 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL

      42
    • 6.1.4 Thermal Metrology

      44
  • 6.2 Processor Thermal Features

    44
    • 6.2.1 Processor Temperature

      44
    • 6.2.2 Adaptive Thermal Monitor

      44
    • 6.2.3 THERMTRIP# Signal

      48
  • 6.3 Platform Environment Control Interface (PECI)

    48
    • 6.3.1 Introduction

      48
    • 6.3.2 PECI Client Capabilities

      49
    • 6.3.3 Temperature Data

      49
• 7 Sensor Based Thermal Specification Design Guidance

  51
  • 7.1 Sensor Based Specification Overview

    51
  • 7.2 Sensor Based Thermal Specification

    52
    • 7.2.1 TTV Thermal Profile

      53
    • 7.2.2 Specification When DTS value is Greater than TCONTROL

      53
  • 7.3 Thermal Solution Design Process

    54
    • 7.3.1 Boundary Condition Definition

      55
    • 7.3.2 Thermal Design and Modelling

      56
    • 7.3.3 Thermal Solution Validation

      56
  • 7.4 Fan Speed Control (FSC) design process

    56
  • 7.5 System Validation

    58
• 8 1U Collaboration Thermal Solution

  59
  • 8.1 Performance Targets

    59
  • 8.2 Thermal Solution

    62
  • 8.3 Assembly

    63
  • 8.4 Geometric Envelope for 1U Thermal Mechanical Design

    64
  • 8.5 Thermal Interface Material

    64
• 9 Thermal Solution Quality and Reliability Requirements

  65
  • 9.1 Collaboration Heatsink Thermal Verification

    65
  • 9.2 Mechanical Environmental Testing

    65
    • 9.2.1 Recommended Test Sequence

      66
    • 9.2.2 Post-Test Pass Criteria

      66
    • 9.2.3 Recommended BIOS/Processor/Memory Test Procedures

      66
  • 9.3 Material and Recycling Requirements

    67
• 10 Boxed Processor Specifications

  69
  • 10.1 Introduction

    69
  • 10.2 Mechanical Specifications

    70
    • 10.2.1 Boxed Processor Cooling Solution Dimensions

      70
    • 10.2.2 Boxed Processor Fan Heatsink Weight

      72
    • 10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      72
  • 10.3 Electrical Requirements

    72
    • 10.3.1 Fan Heatsink Power Supply

      72
  • 10.4 Thermal Specifications

    73
    • 10.4.1 Boxed Processor Cooling Requirements

      73
    • 10.4.2 Variable Speed Fan

      75
• A Component Suppliers

  77
• B Mechanical Drawings

  79
• C Socket Mechanical Drawings

  97
• D Package Mechanical Drawings

  103