Manuale Utente (BX80605X3440)SommarioIntel® Xeon® Processor 3400 Series and LGA1156 Socket11 Introduction71.1 References71.2 Definition of Terms82 Package Mechanical and Storage Specifications112.1 Package Mechanical Specifications112.1.1 Package Mechanical Drawing122.1.2 Processor Component Keep-Out Zones122.1.3 Package Loading Specifications132.1.4 Package Handling Guidelines132.1.5 Package Insertion Specifications132.1.6 Processor Mass Specification132.1.7 Processor Materials142.1.8 Processor Markings142.1.9 Processor Land Coordinates152.2 Processor Storage Specifications163 LGA1156 Socket173.1 Board Layout193.2 LGA1156 Socket NCTF Solder Joints203.3 Attachment to Motherboard213.4 Socket Components213.4.1 Socket Body Housing213.4.2 Solder Balls223.4.3 Contacts223.4.4 Pick and Place Cover223.5 Package Installation / Removal233.5.1 Socket Standoffs and Package Seating Plane243.6 Durability243.7 Markings253.8 Component Insertion Forces253.9 Socket Size254 Independent Loading Mechanism (ILM)274.1 Design Concept274.1.1 ILM Cover Assembly Design Overview274.1.2 ILM Back Plate Design Overview284.1.3 Shoulder Screw and Fasteners Design Overview294.2 Assembly of ILM to a Motherboard304.3 ILM Interchangeability314.4 Markings325 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications335.1 Component Mass335.2 Package/Socket Stackup Height335.3 Socket Maximum Temperature335.4 Loading Specifications345.5 Electrical Requirements355.6 Environmental Requirements366 Thermal Specifications376.1 Thermal Specifications376.1.1 Intel® Xeon® Processor 3400 Series (95W) Thermal Profile396.1.2 Intel® Xeon® Processor 3400 Series (45W) Thermal Profile416.1.3 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL426.1.4 Thermal Metrology446.2 Processor Thermal Features446.2.1 Processor Temperature446.2.2 Adaptive Thermal Monitor446.2.3 THERMTRIP# Signal486.3 Platform Environment Control Interface (PECI)486.3.1 Introduction486.3.2 PECI Client Capabilities496.3.3 Temperature Data497 Sensor Based Thermal Specification Design Guidance517.1 Sensor Based Specification Overview517.2 Sensor Based Thermal Specification527.2.1 TTV Thermal Profile537.2.2 Specification When DTS value is Greater than TCONTROL537.3 Thermal Solution Design Process547.3.1 Boundary Condition Definition557.3.2 Thermal Design and Modelling567.3.3 Thermal Solution Validation567.4 Fan Speed Control (FSC) design process567.5 System Validation588 1U Collaboration Thermal Solution598.1 Performance Targets598.2 Thermal Solution628.3 Assembly638.4 Geometric Envelope for 1U Thermal Mechanical Design648.5 Thermal Interface Material649 Thermal Solution Quality and Reliability Requirements659.1 Collaboration Heatsink Thermal Verification659.2 Mechanical Environmental Testing659.2.1 Recommended Test Sequence669.2.2 Post-Test Pass Criteria669.2.3 Recommended BIOS/Processor/Memory Test Procedures669.3 Material and Recycling Requirements6710 Boxed Processor Specifications6910.1 Introduction6910.2 Mechanical Specifications7010.2.1 Boxed Processor Cooling Solution Dimensions7010.2.2 Boxed Processor Fan Heatsink Weight7210.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly7210.3 Electrical Requirements7210.3.1 Fan Heatsink Power Supply7210.4 Thermal Specifications7310.4.1 Boxed Processor Cooling Requirements7310.4.2 Variable Speed Fan75A Component Suppliers77B Mechanical Drawings79C Socket Mechanical Drawings97D Package Mechanical Drawings103Dimensioni: 3,42 MBPagine: 106Language: EnglishApri il manuale
